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Preparation method of metamaterial and metamaterial

A metamaterial and functional board technology, applied in the field of metamaterials, can solve the problems of limited selectivity and insufficient flexibility affecting the permittivity and permeability, permittivity and permeability, and achieve good uniformity , a wide range of material selectivity, and the effect of expanding the range of functional applications

Active Publication Date: 2013-02-13
KUANG CHI INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, metal microstructures can have artificially designed electromagnetic parameters, resulting in many novel phenomena
[0003] The artificial microstructures of the existing metamaterial functional boards are generally arrayed on the surface or inside of the dielectric substrate, and the metamaterial functional boards of each layer are closely combined to form the entire metamaterial, and the equivalent dielectric constant or equivalent magnetic permeability of each unit is the medium The superposition of the dielectric constant or magnetic permeability of the substrate and the artificial microstructure, because the selection of the dielectric substrate is limited by the functional application of the metamaterial, the selectivity of the dielectric constant and magnetic permeability is limited, so it can only be changed by changing Artificial microstructures are used to change the equivalent permittivity or equivalent permeability of the entire metamaterial. Although artificial microstructures can produce specific responses to electromagnetic waves through specific arrangement rules, they cannot affect a wide range. The permittivity and permeability of the entire metamaterial, so the design of the overall permittivity and permeability of the entire metamaterial is still not flexible enough and has many limitations

Method used

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  • Preparation method of metamaterial and metamaterial
  • Preparation method of metamaterial and metamaterial
  • Preparation method of metamaterial and metamaterial

Examples

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Embodiment 1

[0025] Taking the metamaterial with the dielectric substrate of the polymer material as an example, although the polymer material has good mechanical properties, the general dielectric constant of the polymer material is low. In order to obtain a higher dielectric constant, it is very convenient to adopt the method of the present invention Calcium copper titanate (CaCu) with high dielectric constant 3 Ti 4 o 12 ) to prepare metamaterials by sol-gel process, the specific preparation process is as follows:

[0026] a. Multiple artificial microstructures are arrayed on the dielectric substrate of the metamaterial functional board to form a metamaterial functional board;

[0027] b. Fix multiple metamaterial functional boards in the mold according to the predetermined interval;

[0028] c. Accurately weigh calcium nitrate (concentration 99%), copper nitrate (concentration 99.5%), butyl titanate (analytical pure) according to molar ratio Ca: Cu: Ti is the ratio of 1: 3: 4 for la...

Embodiment 2

[0035] Sometimes, in order to make the metamaterial obtain higher magnetic permeability, it can be realized very conveniently after adopting the method of the present invention, with cobalt-nickel ferrite (Co 1-x Ni x Fe 2 o 4 ) as an example, the specific process of preparing metamaterials by sol-gel process is as follows:

[0036] a. Multiple artificial microstructures are arrayed on the dielectric substrate of the metamaterial functional board to form a metamaterial functional board;

[0037] b. Fix multiple metamaterial functional boards in the mold according to the predetermined interval;

[0038] c. First weigh a certain amount of citric acid and add it to distilled water and heat it in a constant temperature water bath at 80°C. After the citric acid is completely dissolved, add ferric nitrate, cobalt nitrate and nickel nitrate in turn, wherein the molar ratio of cobalt-nickel ions is 0.5:0.5, the molar ratio of ferric nitrate and citric acid is 1:1;

[0039] d. Sti...

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Abstract

Provided in the present invention are a metamaterial manufacturing method allowing for flexible setting of the magnitudes of the dielectric constant and of the magnetic permeability of a metamaterial and the metamaterial. The metamaterial manufactured using the method is formed by combining multiple layers of metamaterial functional boards. Each metamaterial functional board comprises a dielectric substrate and multiple artificial microstructures arrayed on the dielectric substrate. The metamaterial functional boards have formed therebetween a unibody material. The unibody material is manufactured using a sol-gel process. Employment of the metamaterial manufacturing method and the metamaterial of the present invention allows for designing at will the dielectric constant and the magnetic permeability of the metamaterial, and for greater selection of materials, thus broadening to the greatest extent the scope of functional applications of the metamaterial.

Description

【Technical field】 [0001] The invention relates to the field of metamaterials, in particular to composite preparation technology of supermaterials. 【Background technique】 [0002] The so-called metamaterials refer to some artificial composite structures or composite materials with extraordinary physical properties that natural materials do not have. Through the orderly design of the structure on the key physical scale of the material, the limitations of some apparent natural laws can be broken through, so as to obtain ordinary supernormal material functions beyond the inherent nature. For example, metamaterials are formed by stacking or arraying multiple layers of metamaterial functional plates. Metamaterial functional plates are composed of a dielectric substrate and multiple metal microstructures arranged on the dielectric substrate. Metamaterials can provide various common materials with and without material properties. The size of a single metal microstructure is genera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q15/00
CPCC23C18/1254C23C18/00H01Q15/0006H01Q15/0086
Inventor 刘若鹏赵治亚王文剑
Owner KUANG CHI INST OF ADVANCED TECH
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