Solid-state imaging device, manufacturing method thereof, and electronic device

Abstract

The present invention relates to a solid-state imaging device, a manufacturing method thereof, and an electronic device using the solid-state imaging device. The solid-state imaging device includes: a supporting substrate including a concave portion; a solid-state imaging chip bonded to the supporting substrate to seal the concave portion in a viewing angle region of the solid-state imaging chip; and a stress film formed on the solid-state imaging chip. on the surface of the solid-state imaging chip; and an imaging surface in which the viewing angle area is bent toward the concave portion by the stress of the stress film. In the present invention, by bending the viewing angle area, the coincidence accuracy between the center of the viewing angle area and the optical center of the imaging lens system is improved, and the suppression of lens aberration is enhanced.

Description

[0001] Cross References to Related Applications [0002] The present application contains subject matter related to the disclosure of Japanese Priority Patent Application JP 2010-260973 filed in the Japan Patent Office on Nov. 24, 2010, the entire content of which is hereby incorporated by reference. technical field [0003] The present invention relates to a solid-state imaging device, a method of manufacturing the same, and an electronic device such as a camera including the solid-state imaging device. Background technique [0004] As a solid-state imaging device (imaging sensor), a CMOS solid-state imaging device, a CCD solid-state imaging device, and the like are known. Such as Figure 39 As shown, a camera 161 using a solid-state imaging device generally includes a solid-state imaging device 162 formed in a flat plate shape and an imaging lens system 164 composed of a plurality of lenses 163 . When an imaging lens system images an object, a focus position deviates betw...

AI Technical Summary

Problems solved by technology

That is, when the semiconductor chip 167 is bent one by one, microfabrication is impossible, and the center P of the viewing angle area and the optical center Q of the lens are difficult to coincide with each other

Therefore, it is difficult to focus uniformly across the entire viewing angle area

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