Automatic detaching machine for abandoned electronic circuit board element

Abstract

The invention relates to an automatic detaching machine for an abandoned electronic circuit board element and belongs to the technical field of metallurgy and chemical industry. The automatic detaching machine comprises a horizontal shell, wherein a feeding port is formed at the front end of the shell; a rotary furnace and a rotary screen are respectively arranged in the shell along the horizontal direction according to a sequence; a discharging port is arranged at the rear end of the rotary furnace; a transmission mechanism is respectively connected with the exteriors of the rotary furnace and the rotary screen; the rotary screen comprises a first screen, a second screen and a third screen, the meshes of which are increasingly big; a tin solder blanking port is arranged under the first screen; an element blanking port is arranged under the second screen; a plate blanking port is arranged on the third screen; a substrate blanking port is arranged under the third screen; a nozzle passes through the rear end of the shell; a connecting fan is fixed in the shell; an air pipe is connected with the fan; and a thermodetector is arranged on the upper part of a superposed area of the rotary furnace and the rotary screen on the shell. The automatic detaching machine provided by the invention is simple in operation, strong in adaptability to circuit boards in different sizes, low in production cost and higher in processing capacity.

Description

technical field [0001] The invention relates to an automatic dissociation machine for waste electronic circuit board components, which belongs to the technical field of metallurgy and chemical industry. Background technique [0002] Waste electronic circuit boards come from waste TVs and computers. Most of the components such as capacitors, high-voltage packs, resistors, diodes, triodes, and radiators are connected to the circuit board substrate by solder spot welding. Waste electronic circuit boards All processing needs to disassemble the components first, and then sort and recycle them. At present, the equipment for dismantling components of waste electronic circuit boards includes: [0003] 1. Baking plate dissociation equipment: place the waste electronic circuit board with the front facing up, and the lower part is heated by resistance, and heat the back of the waste electronic circuit board through the heat radiation baking plate to melt the solder, and then use the v...

AI Technical Summary

Problems solved by technology

Its characteristic is that the scraper is damaged quickly, the processing capacity is small, and the solder needs to be processed separately for recycling

[0006] 4. Thermal shock dissociation equipment: install the waste circuit board on the card slot, and then use high temperature and high pressure air to impact the solder joints to separate them, which can realize non-destructive disassembly, but there are disadvantages of cumbersome operation and small processing capacity

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