Dummy fill insertion method for integrated circuit layout
A redundant metal and integrated circuit technology, applied in the fields of electrical digital data processing, instruments, calculations, etc., can solve the problem of increased calculation, increased design difficulty, increased interconnection capacitance, signal delay, chromaticity, brightness, interference and noise energy consumption and other issues to achieve the effect of reducing the impact, improving reliability, reducing the impact of convergence and signal integrity
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[0015] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0016] In integrated circuit manufacturing and layout design, the problem that redundant metals increase the coupling capacitance of signal lines is often encountered.
[0017] Such as figure 1 As shown, a redundant metal 3 with a defined area is filled between the two parallel signal lines 1 and 2 . Since the filling position and filling shape of the redundant metal 3 are not considered, the redundant metal has a great influence on the coupling capacitance between the two signal lines.
[0018] The filling method of the redundant metal in the layout of the integrated circuit disclosed by the present invention fully considers the filling position and filling shape of the redundant metal between the signal lines. In order to achieve t...
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