Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Headset interface and GPIO (General Purpose Input/Output) interface multiplex circuit structure

A technology of interface multiplexing and circuit structure, applied in transducer circuits, stereo circuit arrangements, electrical components, etc., to achieve the effect of expanding functions

Inactive Publication Date: 2012-04-25
SILICON STAR TECH
View PDF5 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the headset interface only acts as a bridge connecting the headset device with the audio codec, baseband or processor, etc. Therefore, the headset interface in the prior art can only realize the connection between the host and the headset device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Headset interface and GPIO (General Purpose Input/Output) interface multiplex circuit structure
  • Headset interface and GPIO (General Purpose Input/Output) interface multiplex circuit structure
  • Headset interface and GPIO (General Purpose Input/Output) interface multiplex circuit structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] see figure 2 In this embodiment, the multiplexing circuit structure of the headset interface and the GPIO interface is configured as a traditional headset interface. The output terminal 31 of the first power amplifier PA1 is connected to the second capacitor C2 and then connected to the left channel earphone interface HPL, and the second general input and output interface GPIO2 is connected to the left channel earphone interface HPL; The output terminal 41 of the second power amplifier PA2 is connected with the third capacitor C3 and connected with the right channel earphone interface HPR, and the third general input and output interface GPIO3 is connected with the right channel earphone interface HPR; the microphone 51 is connected to the right channel earphone interface HPR. Between the microphone interface MIC and the ground port GND, the left earphone 52 is connected between the left channel earphone interface HPL and the ground port GND, and the right earphone 53 ...

Embodiment 2

[0041] see image 3 In this embodiment, the headset interface and GPIO interface multiplexing circuit structure is configured as a GPIO general data interface. The output terminal 31 of the first power amplifier PA1 is connected to the fourth capacitor C4 and then connected to the left channel earphone interface HPL, and the second general input and output interface GPIO2 is connected to the left channel earphone interface HPL; The output terminal 41 of the second power amplifier PA2 is connected to the fifth capacitor C5 and then connected to the right channel earphone port HPR, and the third general input and output interface GPIO3 is connected to the right channel earphone port HPR. The first control signal SHD_BIAS, the second control signal SHD_MIC, the third control signal SHD_HPL, and the fourth control signal SHD_HPR sent by the host register are all at high level. Correspondingly, the low dropout linear regulator LDO and The programming gain amplifier PGA, the first ...

Embodiment 3

[0043] see Figure 4 In this embodiment, the multiplexing circuit structure of the headset interface and the GPIO interface is configured as an I2C interface. The first control signal SHD_BIAS, the second control signal SHD_MIC, the third control signal SHD_HPL, and the fourth control signal SHD_HPR sent by the host register are all at high level. Correspondingly, the low dropout linear regulator LDO and The programming gain amplifier PGA, the first power amplifier PA1 and the second power amplifier PA2 are all disconnected, and are externally shown as a high-impedance state, while the first general-purpose input and output interface GPIO1, the second general-purpose input-output interface GPIO2 and the third general-purpose input The output interface GPIO3 forms an I2C interface through proper configuration. When configuring these three general-purpose input and output interfaces, they can be rotated. Figure 4 Only one of the possible configurations is shown. Such as Fig...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a headset interface and GPIO (General Purpose Input / Output) interface multiplex circuit structure. A host base band or host audio codec comprises a low dropout linear regulator, a programmable grain amplifier, a first power amplifier, a second power amplifier and a grounding terminal, wherein the output end of the low dropout linear regulator, the input end of the programmable grain amplifier and a first general input / output interface are connected in parallel and then the paralleled integrated body is connected with a microphone interface; the grounding terminal of the host base band is connected with a grounding port; the output end of the first power amplifier is connected with a second general input / output interface in parallel and is then is connected with a left channel headset interface; and the output end of the second power amplifier is connected with a third general input / output interface in parallel and is then is connected with a right channel headset interface. According to the headset interface and GPIO interface multiplex circuit structure disclosed by the invention, the connection between the host and headset equipment can be realized, the connection between the host and data interface equipment can be realized and the functions of the headset interface are expanded.

Description

technical field [0001] The invention relates to a multiplexing circuit structure of a headset interface and a GPIO interface. Background technique [0002] Headsets are used in a wide range of applications, so there are headset ports on many devices. In the prior art, the headset interface only acts as a bridge connecting the headset device and the audio codec, baseband or processor, etc. Therefore, the headset interface in the prior art can only realize the connection between the host and the headset device. Contents of the invention [0003] The purpose of the present invention is to provide a headset interface and GPIO interface multiplexing circuit structure, the circuit structure can be configured as both a headset interface and a GPIO interface. [0004] In order to achieve the above object, the present invention provides a headset interface and general input and output interface multiplexing circuit structure, including: a host baseband or host audio codec, a first...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10H04R1/08H04R3/00
CPCG06F3/00H04B15/005H04R3/00H04R5/04H04R5/033
Inventor 奚剑雄陈锋
Owner SILICON STAR TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com