100W aluminum nitride ceramic substrate loading chip with wide solder pad and 50 Ohms impedance

Abstract

The invention discloses a 100W aluminum nitride ceramic substrate loading chip with a wide solder pad and 50 Ohms impedance, which comprises a 5.7*8.9*1.0mm aluminum nitride substrate, a back conducting layer is printed on the back of the aluminum nitride substrate, a resistor and a wire are printed on the front of the aluminum nitride substrate, the wire is connected with the resistor to form a loading circuit, a grounding end of the loading circuit is electrically connected with the back conducting layer, and a glass protective film is printed on the resistor. The 100W aluminum nitride ceramic substrate loading chip with a wide solder pad and 50 Ohms impedance of the structure has excellent VSWR (Voltage Standing Wave Ratio) performance, power on the 5.7*8.9*1.0mm aluminum nitride ceramic substrate reaches 100W, and meanwhile, the property reaches 3G, so that an aluminum nitride ceramic substrate of the size has wider use range and can be better matched with equipment.

Description

technical field [0001] The invention relates to a loading sheet of an aluminum nitride ceramic substrate, in particular to a 100-watt loading sheet of an aluminum nitride ceramic substrate with a wide pad impedance of 50Ω. Background technique [0002] The aluminum nitride ceramic substrate load sheet is mainly used to absorb the reverse input power of the communication components in the communication base station. If it cannot withstand the required power, the load will burn out. In the actual use of the aluminum nitride ceramic substrate load sheet , all need to have leads soldered to the pads of the load chip. At present, most of the market adopts the design process of small pads, because the enlarged pads will directly affect the return loss of the product, which will increase the return loss. But if The use of small pads will adversely affect the convenience of welding and the firmness of welding. Contents of the invention [0003] In view of the above-mentioned defi...

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Problems solved by technology

[0002] The aluminum nitride ceramic substrate load sheet is mainly used to absorb the reverse input power of the communication components in the communication base station. If it cannot withstand the required power, the load will burn out. In the actual use of the aluminum nitride ceramic substrate load sheet , all need to have leads soldered to the pads of the load chip. At present, most of the market adopts the design process of small pads, because the enlarged pads will directly affect the return loss of the product, which will increase the return loss. But if The use of small pads will adversely affect the convenience of welding and the firmness of welding

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