Novel optimized 150 W loading piece with aluminum nitride ceramic substrate

Abstract

The invention discloses a novel optimized 150 W loading piece with an aluminum nitride ceramic substrate. The loading piece comprises the aluminum nitride ceramic substrate with the size of 5.7 mm*9.55 mm* 1mm, a back conductive layer is printed on the back face of the aluminum nitride substrate, a resistor and a wire are printed on the front face of the aluminum nitride substrate and connected to form a loading circuit, the loading circuit is connected with the back conductive layer through the grounding end, and the wire is connected with a bonding pad. The bonding pad of the novel optimized 150 W loading piece with the aluminum nitride ceramic substrate is designed and arranged on the upper left corner, in this way, the requirement for adding leads on the side edge of a client can be met, the circuit is optimized due to the design, a traditional design that the bonding pad is located in the middle is changed, the area of the resistor is increased, and therefore the substrate which can only bear 100 W power originally can bear 150 W power, wherein the size of the substrate is 5.7 mm*9.55 mm* 1mm. The loading piece meets the actual application requirement in the aspect of characteristics, is high in VSWR performance and can be matched with equipment better.

Description

technical field [0001] The invention relates to a supporting sheet of an aluminum nitride ceramic substrate, in particular to a novel optimized version of a 150-watt supporting sheet of an aluminum nitride ceramic substrate. Background technique [0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out. At present, most communication base stations use high-power ceramic load chips to absorb the reverse input power of communication components, requiring the basic size to be smaller and smaller, while the power to be absorbed is getting larger and larger. [0003] At present, the domestic power can reach 150 watts. One kind of load chip is to use BeO material. This material is poisonous. It is easy to pollute the environment during the production proc...

AI Technical Summary

Problems solved by technology

[0004] At present, the load plate is designed with the pad in the center of the load plate. Customers can only solder the leads in one direction, which is limited in the design of the communication system.

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