Silicon foaming adhesive composition and its preparation method, silicon foaming adhesive and ultrasonic sensor
A foamed rubber and composition technology, applied in the field of silicon foamed rubber composition and preparation thereof, can solve the problems of ultrasonic sensor with large aftershock and impedance, low porosity of silicon foamed rubber, uneven pore size and the like
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Embodiment 1
[0049] (1) The ratio (parts by weight) of each component is shown in Table 1: First, add OBSH and alum to the mortar in sequence according to the ratio, and mix evenly for 6 minutes to obtain a foaming mixture; then mix polydimethylsilane according to the ratio Add oxane (molecular weight: 5000), dimethyl silicone oil (viscosity: 10cps), silicone resin (1153 silicone resin), silicon micropowder (average particle size: 2um), coupling agent (KH550) into the mixing drum, and add air bubbles under stirring The mixture was continuously stirred for 20 minutes after the addition; the silicon foam composition of this embodiment was obtained, which was denoted as Z1.
[0050] (2) Fill Z1 on top of the piezoelectric ceramic sheet of the ultrasonic sensor, transfer to a vacuum oven and heat at 140°C for 30 minutes to obtain the ultrasonic sensor S1 containing silicon foam J1.
Embodiment 2-5
[0052] Adopt the same step as embodiment 1 to carry out, difference is:
[0053] In step (1), the formula (parts by weight) of the silicone foam composition is shown in Table 1 below:
[0054] Table 1
[0055] Components (parts by weight) Z1 Z2 Z3 Z4 Z5 Polydimethylsiloxane 62 55 70 50 75 Simethicone 24 35 20 23 15 Silica powder 7 5 5 20 6 Silicone 1 1.5 1 2 0.5 coupling agent 3 1 3 1 2.5 OBSH 1.5 1.5 0.5 1 0.5 Crystal Hydrate Alum, 1.5 Gallbladder, 1 Green vitriol, 0.5 plaster, 3 Glauber's salt, 0.5
[0056] Through the above steps, ultrasonic sensors S2-S5 respectively containing silicon foam rubbers J2-J5 are obtained.
Embodiment 6
[0058] Adopt the same step as embodiment 1 to carry out, difference is:
[0059] In step (3), the heating temperature is 130°C, and the heating time is 40 minutes;
[0060] Through the above steps, the ultrasonic sensor S6 containing the silicon foam J6 is obtained.
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