Electronic device and production method of metal casing of electronic device

Abstract

An electronic device comprises a metal casing and a supporting frame fixedly connected with the metal casing. The metal casing comprises a bottom wall and a lateral wall extending from the periphery of the bottom wall to one side of the periphery. An indented portion is formed in the middle of the bottom wall through a chemical corrosion method, and the thickness of the bottom wall close to the periphery of the lateral wall is bigger than that of the indented portion. A production method of the metal casing of the electronic device comprises following steps: blanking to provide metal blanks; punching to obtain a pre-molded body of the metal casing, wherein the pre-molded body comprises a bottom wall and a lateral extending from the periphery of the bottom wall to one side of the periphery; and conducting chemical corrosion on the pre-molded body to form the indented portion in the middle of the bottom wall to obtain the metal casing, wherein the thickness of the periphery of the bottom wall close to the lateral wall is bigger than that of the indented portion. The indented portion of the metal casing is formed through the chemical corrosion method, stability of the whole structure can be kept, and fall resisting performance of the electronic device is improved.

Description

technical field [0001] The invention relates to an electronic device and a method for manufacturing a metal casing of the electronic device. Background technique [0002] In recent years, some electronic devices have begun to use metal casings. In order to meet consumers' requirements for thinner and lighter electronic devices, the metal casings used in electronic devices are becoming lighter and thinner. The thickness is generally about 1mm, and the thinnest part is even only about 0.5mm. mm, however, the thinning of the metal shell will weaken the structural strength, resulting in a decrease in the drop resistance of the electronic device. If the electronic device is impacted by external force or accidentally dropped, the electronic device may be damaged. How to make electronic devices thinner and ensure better anti-drop performance is a problem that the industry has been working hard to solve. Contents of the invention [0003] In view of the above situation, it is ne...

AI Technical Summary

Problems solved by technology

[0002] In recent years, some electronic devices have begun to use metal casings. In order to meet consumers' requirements for thinner and lighter electronic devices, the metal casings used in electronic devices are becoming lighter and thinner. The thickness is generally about 1mm, and the thinnest part is even only about 0.5mm. mm, however, the thinning of the metal shell will weaken the structural strength, resulting in a decrease in the drop resistance of the electronic device

If the electronic device is subjected to external shock or accidental drop, it may damage the electronic device

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