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Heat curable epoxy resin composition with water as foaming agent

A technology of solid epoxy resin and epoxy resin, applied in the direction of epoxy resin glue, novolac epoxy resin adhesive, adhesive, etc., can solve the problems of poor mechanical properties and adhesion properties, and achieve high mechanical strength , Eliminate the use of foaming agent, the effect of high glass strength

Inactive Publication Date: 2012-04-04
SIKA TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the mechanical properties (especially glass transition temperature) and adhesion properties of this composition are deteriorated due to the high content of SBS-block copolymer

Method used

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  • Heat curable epoxy resin composition with water as foaming agent
  • Heat curable epoxy resin composition with water as foaming agent
  • Heat curable epoxy resin composition with water as foaming agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0104]

[0105] Most preferably, the hydroxyalkylamide or hydroxyalkylurea H is a hydroxyalkylamide.

[0106] It is assumed that the hydroxyalkylamide or hydroxyalkylurea H and the carboxylic acid C form an interpenetrating network with the epoxy resin, which can be partially linked to the epoxy resin matrix through the carboxyl groups. Therefore, the concentration of carboxyl-terminated polymers (such as polyesters) or carboxylic acids must always be lower than that of the epoxy component, so as not to significantly lower the glass transition temperature of the composition.

[0107] As mentioned above, the proportion of accelerator E is chosen such that the onset temperature of the reaction between solid epoxy resin A1 , liquid epoxy resin A2 and curing agent B drops substantially as measured by DSC. It can thus be ensured that the reaction of these components takes place sufficiently rapidly and thus ensures a sufficiently high viscosity in this way.

[0108] In order to...

Embodiment

[0142] Preparation of Examples 1-8

[0143] Table 1 Raw materials used

[0144]

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Abstract

Heat-curable epoxy resin compositions and the use thereof, for example, in motor vehicle construction and sandwich panel construction, are disclosed. Exemplary heat-curable epoxy resin compositions include, in addition to epoxy resin components A1, optionally A2, a hardener component B, a carboxylic acid C and a hydroxyalkylamide or hydroxyalkylurea H, an accelerator E for activation of the conversion of components A1, A2 and B. The compositions and the structural foams produced therefrom are notable for high mechanical strength, high glass strength and good adhesion capacity on metallic and nonmetallic substrates, and it is possible at the same time to dispense with the use of toxic or inflammable blowing agents.

Description

technical field [0001] The present invention relates to a thermosetting epoxy resin composition and its application especially in the manufacture of automobiles and sandwich instrument panels. Background technique [0002] Thermosetting epoxy resin compositions have long been used as adhesives in body-in-white as well as reinforcement elements or structural foams. [0003] An important field of application of thermosetting epoxy resin compositions is in automobile construction, in particular when bonding or foaming cavities in body-in-white. In both cases, depending on the application of the epoxy resin composition, the car body is heated in a KTL (cathode dip coating) furnace, whereby the thermosetting epoxy resin composition cures and possibly foams. [0004] Reinforcing elements with thermosetting epoxy resin compositions form structural foams under the action of heat, such reinforcing elements are known, for example, under the trade name A known. Patent document US 6...

Claims

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Application Information

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IPC IPC(8): C08G59/24C08G59/38C08G59/50C08G59/68C08K5/092C08K5/20C08K5/21C08L63/02C08L63/04C08J9/06C09J163/02C09J163/04
CPCC08G59/4021C08J9/02C08G59/46C08G59/48C08G59/42C08G59/4246C08G59/44C08J2363/00C08J9/0023C08J9/0028C08G59/18C08J9/12C08K5/09C08L63/00
Inventor J·芬特E·詹多比
Owner SIKA TECH AG
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