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Single-component epoxy resin conductive adhesive

An epoxy resin and adhesive technology, applied in epoxy resin adhesive, novolac epoxy resin adhesive, conductive adhesive, etc., can solve the problem of poor heat resistance, low glass transition temperature, unfavorable conductive adhesive treatment or application, etc.

Active Publication Date: 2012-03-28
浙江英特沃斯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the storage time of the old epoxy resin conductive adhesive at room temperature is only 24 hours, and the storage time at room temperature is two weeks, and the heat resistance is poor, that is, the glass transition temperature is low, generally 60°C, which is not conducive to the processing or application of the conductive adhesive.

Method used

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  • Single-component epoxy resin conductive adhesive
  • Single-component epoxy resin conductive adhesive
  • Single-component epoxy resin conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] First heat and mix various resin parts, namely 7g epoxy resin E-51, 5g toughening agent EPICLON750, 6g curing agent phenol novolac resin, then add 1g accelerator EH3293S, 73g conductive filler silver powder, and 8g solvent ethylene glycol ether , ball milling, natural degassing during the mixing process, and airtight mixing.

Embodiment 2

[0045] First heat and mix various resin parts, namely 10g epoxy resin EPICLON850-CRP, 3g toughening agent CTBN, 8g curing agent dicyandiamide, then add 1g accelerator PN-23, 72g conductive filler silver powder, and 6g solvent ethyl acetate , ball milling, natural degassing during the mixing process, and airtight mixing.

Embodiment 3

[0047] First heat and mix various resin parts, that is, 10g epoxy resin E-51, 5g toughening agent EPICLON750, 8g curing agent phenol novolac resin, then add 2g accelerator MY-24, 70g conductive filler copper powder, and 5g solvent pine Oleyl alcohol, mixed by ball milling, natural degassing during the mixing process, and airtight mixing.

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PUM

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Abstract

The invention relates to an epoxy resin conductive adhesive and a preparation method thereof. The epoxy resin conductive adhesive comprises 3-10% of epoxy resin, 1-8% of toughening agent, 5-10% of latent curing agent, 1-5% of latent accelerating agent, 5-10% of solvents and 60-85% of conductive filler. The adhesive lengthens the retention time on the basis of maintaining lower volume resistivity and increases the glass transition temperature (TG) of the material so as to expand the application range of the adhesive and simplify the processing process of the adhesive.

Description

technical field [0001] The invention relates to a one-component epoxy resin conductive adhesive. Background technique [0002] Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive adhesive. The path realizes the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, a suitable curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, The conductive adhesive can be made into a paste to achieve high line resolution. Moreover, the conductive adhesive has a simple process, is easy to operate, and can improve pro...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/02C09J163/02C09J163/04C09J11/04
Inventor 李昭迪
Owner 浙江英特沃斯科技有限公司
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