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Radiating device and electronic device using same

A technology of heat dissipation device and electronic device, which is applied in the fields of electrical digital data processing, cooling/ventilation/heating transformation, instruments, etc., can solve the problems of incapable of increasing heat dissipation of other heat dissipation devices, affecting the stability of electronic devices, overheating of electronic components, etc. Achieving cost savings, high feasibility, and guaranteed performance

Inactive Publication Date: 2012-03-21
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When this cooling device is in use, the airflow provided by the fan only flows out of the electronic device after passing through the radiator, and cannot effectively dissipate heat for other electronic components in the electronic device.
This will cause some electronic components in the electronic device to overheat
Due to the limitation of the structure and internal space of the electronic device, it is not possible to add other heat sinks to dissipate heat from other overheated electronic components, thereby affecting the stability of the electronic device

Method used

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  • Radiating device and electronic device using same
  • Radiating device and electronic device using same
  • Radiating device and electronic device using same

Examples

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Embodiment Construction

[0045] see figure 1 , which shows an electronic device 100 according to an embodiment of the present invention. The electronic device 100 includes a casing 30 , a circuit board 20 fixed in the casing 30 and a heat dissipation device 10 accommodated in the casing 30 . A central processing unit 21 , a south bridge chip 22 and a memory card 23 are arranged at intervals on the circuit board 20 . The cooling device 10 is used for cooling the central processing unit 21 , the south bridge chip 22 and the memory card 23 on the circuit board 20 .

[0046] The casing 30 is a hollow cuboid with a smaller thickness, which includes a rectangular bottom plate 31, a rectangular top plate 34 corresponding to the bottom plate 31, and two vertically extending upwards from the opposite ends of the bottom plate 31. The first side board 32 and two second side boards 33 vertically extend upward from opposite ends of the bottom board 31 . The first side panel 32 and the second side panel 33 are c...

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Abstract

A radiating device is used for radiating of electronic components and comprises a hot pipe, an air guiding plate, a radiating fin group and a centrifugal fan. The hot pipe comprises a steaming section which is in thermal contact with the electronic components and a condensation section extending from the steaming section. The centrifugal fan is provided with an air outlet, and the radiating fin group is arranged at the air outlet. The condensation section extends to the air outlet and is in thermal connection with the radiating fin group. The air guiding plate extends from the air outlet to one side of the centrifugal fan, and the air guiding plate is provided with a first end close to the air outlet and a second end away from the air outlet. Two sides of the air guiding plate form an air inlet flow channel and an air outlet flow channel respectively. Air flow produced by the centrifugal fan flows in from the air inlet flow channel on one side of the air guiding plate and flows out from the other side of the air guiding plate after passing around the second end of the air guiding plate. The invention further relates to an electronic device using the radiating device.

Description

technical field [0001] The invention relates to a cooling device, in particular to a cooling device capable of cooling multiple electronic components at the same time. The invention also relates to an electronic device using the cooling device. Background technique [0002] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components in electronic devices are also increasing, resulting in more and more heat and higher temperatures generated by electronic components, seriously affecting the performance of electronic devices. In order to ensure the normal operation of electronic devices, the heat generated by these electronic components must be dissipated in a timely manner. For this reason, heat sinks are widely used in various electronic devices. [0003] A commonly used cooling device generally includes a radiator and a fan. The heat sink is formed by interlocking a plurality of heat sinks arranged in ...

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20
Inventor 谭子佳
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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