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Semiconductor fabrication apparatus and temperature adjustment method

A technology for manufacturing equipment and semiconductors, which is applied in the field of semiconductor manufacturing equipment and can solve problems such as difficulty in optimizing flow path design

Inactive Publication Date: 2012-03-14
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since various screws, lift pins, and electrode parts are installed on the semiconductor wafer stage, there are various restrictions on the installation space of the flow path, and it is extremely difficult to optimize the flow path design.

Method used

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  • Semiconductor fabrication apparatus and temperature adjustment method
  • Semiconductor fabrication apparatus and temperature adjustment method
  • Semiconductor fabrication apparatus and temperature adjustment method

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Experimental program
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Effect test

Embodiment approach 2

[0081] Figure 6A is a side sectional view of the wafer stage 102 and the water jet 164 according to the second embodiment, Figure 6B It is a plan view of the water injector 164 of Embodiment 2. The semiconductor manufacturing apparatus of Embodiment 2 differs from the semiconductor manufacturing apparatus of Embodiment 1 only in the shape of the cavity 121 of the wafer stage 102 and the structure of the water injector 164 . Therefore, the above differences will be mainly described below.

[0082] The cavity 121 formed in the wafer stage 102 according to Embodiment 2 has a bottom inner wall portion 121a, a peripheral wall portion 121b, and a top inner wall portion 121c. The top inner wall portion 121c and the bottom inner wall portion 121a have inclined surfaces inclined with respect to the mounting surface on which the semiconductor wafer W is mounted. More specifically, the top inner wall portion 121c is formed in an inverted conical shape having an apex below the substan...

Embodiment approach 3

[0093] Figure 8 It is a schematic diagram showing the wafer stage 2 and the temperature control device 306 according to the third embodiment. The semiconductor manufacturing apparatus according to the third embodiment heats and adjusts the temperature of the wafer mounting table 2 by supplying saturated steam into the cavity 21 of the wafer mounting table 2 . The semiconductor manufacturing apparatus according to the third embodiment is different from the first embodiment only in the structure of the wafer mounting table 2 and the temperature control device 306 , and therefore, the above differences will be mainly described below.

[0094] The temperature control device 306 of Embodiment 3 does not include the water injector 64, the temperature controller 62, and the flow sensor 72 described in Embodiment 1, but includes a steam pressure controller 73 for supplying saturated steam into the cavity 21, and Desuperheater 74. In addition, a water vapor supply port (temperature ...

Embodiment approach 4

[0106] Figure 11 It is a schematic diagram showing the wafer stage 2 and the temperature control device 406 according to the fourth embodiment. The wafer semiconductor device according to the fourth embodiment is configured to be capable of heating and cooling the wafer stage 2 by combining the components of the first and third embodiments.

[0107] Like the first embodiment, the wafer stage 2 of the fourth embodiment has a cavity 21 inside, and a water jet 64 is arranged in the cavity 21 . In addition, the wafer stage 2 is provided with the same water vapor supply port 21e as in the third embodiment at an appropriate portion of the bottom inner wall portion 21a.

[0108] The temperature adjustment device 406 in Embodiment 4 includes the same control unit 61 as in Embodiment 1, a temperature controller 62, a water injector 64, a drainer 65, a jet vacuum pump 66, a cold water generator 67, a water supply pump 68, and a flow control valve. 69. Temperature sensor 70, pressure ...

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PUM

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Abstract

A semiconductor fabrication apparatus and temperature adjustment method which can achieve uniform semiconductor wafer temperature adjustment and high responsive in comparison to past temperature adjustment methods. The semiconductor fabrication apparatus is provided with: a wafer carrying table (2) with a cavity inside; and nozzles (64a) which, in order to adjust the temperature of the wafer carrying table (2) to a process temperature, spray the inner walls of the cavity (21) with water of a temperature less than or equal to the process temperature. The apparatus is further provided with: a pressure sensor (71) which detects the pressure inside the cavity (21); and a vacuum pump which discharges the gas inside the cavity (21) so that the pressure detected by the pressure sensor (71) becomes greater than or equal to the saturated vapor pressure relating to the temperature of the water sprayed from the nozzles (64a) and less than or equal to the saturated vapor pressure relating to the process temperature.

Description

technical field [0001] The present invention relates to a semiconductor manufacturing device having a temperature adjustment function of a semiconductor wafer mounting table, and a temperature adjustment method of the semiconductor wafer mounting table. Background technique [0002] A semiconductor manufacturing device includes a temperature control device for maintaining a semiconductor wafer at a predetermined process temperature. The temperature adjustment device performs temperature adjustment by circulating a liquid for temperature adjustment (hereinafter referred to as a temperature adjustment medium) through a flow path formed inside the semiconductor wafer mounting table (for example, Patent Documents 1 and 2). The temperature regulation method that circulates the temperature regulation medium is called the forced convection method. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2001-44176 [0004] Patent Document 2: Japanese Patent Application Laid-Open...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/3065H01L21/677
CPCH01L21/67109H01J37/32449H01J37/32522H01J37/32623H01J2237/2001H01L21/67248H01L21/67253
Inventor 松崎和爱永关澄江
Owner TOKYO ELECTRON LTD
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