Packaging device system adopting intelligent temperature control for glue application control

Abstract

The invention discloses a packaging device system adopting intelligent temperature control for glue application control. The system comprises a glue body box and rotating rollers, the rubber box is located above the rotating rollers, two glue discharging hoppers are arranged on the bottom surface of the glue body box, the two glue discharging hoppers are both located right above the rotating rollers, a motor is fixedly arranged in the center of the bottom end of the glue body box, an output shaft of the motor penetrates through the glue body box and is fixedly connected with a central fixing pipe, the central fixing pipe is fixedly connected with first branch pipes, second branch pipes are fixedly connected to the first branch pipes, and one ends, far away from the central fixing pipe, ofthe first branch pipes are fixedly connected with side pipes. According to the system, cold water or hot water is input into a water conveying pipe so as to adjust temperature of the glue body in theglue body box, the motor is used for driving the central fixing pipe, the first branch pipes, the second branch pipes and the side pipes to rotate together, temperature adjusting work is carried out in the rotating process, so that the temperature of the glue body in the glue body box can be uniformly adjusted, temperature adjusting speed is high, temperature adjusting methods are mild, and usingeffect is good.

Description

technical field [0001] The invention relates to a glue laminating temperature control device, in particular to an intelligent temperature-controlled glue laminating control packaging device system. Background technique [0002] In the process of gluing and packaging, the temperature of the colloid needs to be adjusted to the most suitable temperature to ensure that the products to be packaged can be tightly bonded. However, due to the influence of factors such as the external environment and machinery and equipment, the temperature of the colloid will be unstable and needs to be adjusted. The existing temperature adjustment method uses electric heating wire to heat externally or internally, and air cooling or water cooling is used for external cooling when cooling down. This type of temperature adjustment method is not efficient, and the temperature in the colloid box is uneven. , the use effect is not good. Contents of the invention [0003] The present invention provide...

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Problems solved by technology

[0003] The present invention provides an intelligent temperature control glue control packaging device system, which solves the problem that the existing temperature adjustment method adopts electric heating wire to heat externally or internally, and adopts air cooling or water cooling method for external cooling when cooling. The temperature is not high, and the temperature in the colloid box is uneven

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