Thick-film hybrid integrated circuit surface enveloping process

Abstract

The invention relates to a thick-film hybrid integrated circuit surface enveloping process which comprises the steps that: a thick-film hybrid integrated circuit is soaked into enveloping liquid by a fixture under the conditions of room temperature and 40 percents to 60 percents humidity, is taken out by the fixture and put into a curing furnace to be dried; the enveloping liquid comprises epoxy-phenolic resin, ethanol and acetone, and the proportion of the weight portions is as follows: epoxy-phenolic resin 100, ethanol 15 to 18, and acetone 15 to 18. The fixture comprises a support (1), a slider (2), a group of fixtures (3) and two limit blocks (4). The thick-film hybrid integrated circuit surface enveloping process has the advantages that: the product for which the enveloping process is adopted has good high temperature and low temperature resistance; a black protective layer is formed on the surface of the product after the product is cured, and the product has excellent insulation, damp-proof, current leakage resistant, anti-shock, dust-proof, anti-corrosive, anti-aging, corona-resistant and other properties, so that the high performance of the thick-film integrated circuit is displayed, and the service life of components which are laminated on the surface can be effectively improved. Because the fixture is adopted, the time can be saved, so that the working efficiency is improved.

Description

technical field [0001] The invention relates to the processing of thick film hybrid integrated circuits. Background technique [0002] Thick-film hybrid integrated circuit is a production process of circuit products that uses ceramics as a carrier, uses paste printing and firing processes, and cooperates with high-precision laser trimming and SMT assembly and welding processes. Due to the reliable performance of the integrated circuits produced by the thick film process , flexible design and widely used in places with harsh environments such as precision medical equipment, high-speed rail signal detection and control, etc., which require high reliability, high performance, high voltage, high current, and high power. Appropriate appearance protection or three-proof technology of products will directly improve the performance of thick film integrated circuits, improve the life of devices mounted on thick film products, and effectively protect the circuit structure. Due to the...

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the existing epoxy encapsulation method will directly lead to the breakage of the device or line of the product due to the inconsistency between the expansion coefficient and the ceramic characteristics, resulting in early failure of the product, thus seriously affecting the service life of the product. Insufficient, but to provide a thick film hybrid integrated circuit surface encapsulation process

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