Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Novel intelligent card module and productive technology thereof

A smart card, a new type of technology, is applied in the direction of record carriers used in machines, instruments, computer parts, etc., which can solve the problems of reducing the market competitiveness of finished products and expensive prices, so as to improve market competitiveness, reduce production costs, and reduce product costs. Effect

Active Publication Date: 2012-02-01
SHANGHAI CHANGFENG SMART CARD
View PDF5 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the problem that the above-mentioned existing intelligent module packaging technology needs to rely on expensive carrier tape, thereby reducing the market competitiveness of finished products, and provides a new type of smart card module and corresponding production technology. The module has a very low packaging cost, and at the same time The corresponding production process has high production efficiency, and the finished product can effectively meet the reliability requirements of the smart card industry for smart card modules

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel intelligent card module and productive technology thereof
  • Novel intelligent card module and productive technology thereof
  • Novel intelligent card module and productive technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0033] Since the conventional smart module packaging requires the corresponding carrier tape to be able to directly punch gold wires, and this kind of carrier tape is currently exclusively produced by foreign manufacturers, the cost of molds is high, and the unit price is expensive. As a result, the cost of encapsulating the smart module is high, which greatly reduces the market competitiveness of the corresponding smart module.

[0034] In view of the above situation, the present invention avoids adopting the encapsulation structure of conventional smart modules, and provides a new smart card module.

[0035] see figure 1 , The smart card module provided by the present invention includes two parts: a CFN module 1 and a carrier 2 .

[0036] Am...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a novel intelligent card module and a productive technology thereof; the module is formed through the adhesive bonding of a CFN (Connection Frame Number) module and a carrier tape; the productive technology thereof comprises the following steps of: (1) patching; (2) splitting the patch into the carrier tape; (3) punching; (4) testing; and (5) finishing the manufacture of cards. The productive technology has the advantages of substantially improving the production efficiency and reducing the production materials and manufacturing cost of the intelligent card modules by combining the CFN (Connection Frame Number) module and a PET (polyethylene terephthalate) circuit board.

Description

Technical field: [0001] The invention relates to microelectronic semiconductor packaging technology, in particular to a novel intelligent module and a production process of the module. Background technique: [0002] With the continuous improvement of integrated circuit packaging technology, the integration level of integrated circuits is increasing day by day, and the functions are becoming more and more abundant. In the field of smart cards, due to the gradual emergence of security and multi-function requirements, it is required to increase reliability with reduced or unchanged costs. [0003] However, conventional smart module packaging generally uses FR4 or G10 as the substrate layer of the carrier tape, and sets up single-sided or double-sided copper clad lines, and then the smart card chip is patched and connected by wire bonding. After completion, it is directly molded or UV package to achieve high reliability of the smart card module. This encapsulation method requi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
Inventor 杨辉峰蒋晓兰马文耀唐荣烨
Owner SHANGHAI CHANGFENG SMART CARD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com