Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Surface treatment device and method thereof

A surface treatment device and surface treatment technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems affecting interface coverage and density, unfavorable component manufacturing process, etc.

Inactive Publication Date: 2012-01-11
IND TECH RES INST
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For example, when a zinc oxide (ZnO) film is deposited in a low pressure chemical vapor deposition (LPCVD) manufacturing process, since the surface morphology of the zinc oxide film is often pyramid-shaped, a sharp film surface is formed, so it will Affects the interface coverage and density, which is not conducive to the fabrication of subsequent components, such as: the fabrication of silicon thin film solar cells with high conversion efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface treatment device and method thereof
  • Surface treatment device and method thereof
  • Surface treatment device and method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0070] In order to enable your review committee to have a further understanding and understanding of the characteristics, purpose and functions of the present invention, the relevant detailed structure and design concept of the device of the present invention will be explained below, so that the review committee can understand the present invention The characteristics are described in detail as follows:

[0071] see Figure 1AAs shown, this figure is a schematic perspective view of an embodiment of the surface treatment device of the present invention. The surface treatment device 2 includes a process chamber 20 , a transmission chamber 21 , a plasma generating device 22 and a control unit 23 . The process chamber 20 has a process space 200 therein to accommodate a substrate 90, and the process chamber 20 can provide a deposition process, so that the substrate 90 in the process chamber 20 is formed as Figure 1B A deposited layer 91 is shown. In this embodiment, the depositi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a surface treatment device and a method thereof. The surface treatment device comprises a process cavity, a transmission cavity and a plasma body generation device, wherein the process cavity provides a deposition manufacture process, the transmission cavity is coupled at one side of the process cavity, an open groove is arranged on the transmission cavity for accommodating the plasma body generation device, and the plasma body generation device generates plasma bodies and guides the plasma bodies into the transmission cavity. The surface treatment device is utilized, the invention also provides a surface treatment method, and after a base plate completes the deposition manufacture process in the process cavity, the plasma body generation device generates the plasma bodies for carrying out surface flattening treatment on deposition layers in the process that the base plate enters the transmission cavity from the process cavity.

Description

technical field [0001] The invention relates to a surface treatment device, in particular to a surface treatment device and a method thereof which use plasma to planarize a deposition layer. Background technique [0002] In the existing thin film manufacturing process, a plasma generating device is placed in the transmission chamber and the process chamber. Before the substrate is transferred to the process chamber, surface cleaning, dry etching, surface activation or modification and other manufacturing processes are performed immediately during the transfer. [0003] For example, when a zinc oxide (ZnO) film is deposited in a low pressure chemical vapor deposition (LPCVD) manufacturing process, since the surface morphology of the zinc oxide film is often pyramid-shaped, a sharp film surface is formed, so it will It affects the coverage and density of the interface, which is not conducive to the fabrication of subsequent element fabrication processes, such as the fabricati...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/00
Inventor 简荣祯杨宏仁张志振林士钦梁沐旺
Owner IND TECH RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com