Apparatus and method for wet-processing object, and fluid diffusion plate and barrel used therein

Abstract

Disclosed are an apparatus and a method for wet-processing (such as cleaning and etching) an object such as a semiconductor wafer or substrate, and a fluid diffusion plate and a barrel used therein. The wet-processing apparatus according to the invention comprises: a treatment bath that contains and treats objects; a plurality of object support pipes that are installed inside the treatment bath and able to rotate, wherein plural slots are formed on the surface of the support pipes and support the object by allowing the object to be vertically positioned at the bottom surface of the treatment bath; and a rotation unit that is connected to and rotates the support pipes to rotate the object in a circumferential direction. The support pipe comprises: a treatment fluid spray hole for spraying the treatment fluid on the object; and a treatment fluid flow path for supplying the treatment fluid to the spray hole. The invention removes a dead zone inside the treatment bath and enables the uniform and smooth flow of the treatment fluid. Therefore, treatment efficiency and uniformity can be improved.

Description

technical field [0001] The present invention relates to apparatus and methods for wet processing (eg cleaning or etching) of objects such as wafers. Background technique [0002] Generally, a series of processes including a slicing process, a grinding process, a lapping process, an etching process, and a polishing process are performed to produce wafers for manufacturing semiconductor devices. During the above process, the surface of the wafer is contaminated with various contaminants. Representative pollutants are particles, metal pollutants, organic pollutants, and the like. These contaminants compromise the quality of the wafer. In addition, contaminants become factors that cause physical defects and deterioration of characteristics of semiconductor devices, which leads to deterioration of semiconductor device product yield. To remove these contaminants, wet cleaning processes using acidic or alkaline etching fluids or deionized water are commonly used. In addition, v...

AI Technical Summary

Problems solved by technology

To prevent this problem, several injection pipes should be installed in the cleaning tank, which in turn causes the problem that the device becomes large and complicated and also becomes another source of contamination

[0006] Also, in the case where the gas supply pipes or lines are installed under the bracket, the gas cannot be adequately supplied to the remote area

This can compromise cleaning or etch uniformity, especially when dealing with large wafer sizes

In addition, in the case of installing multiple diffuser plates, the volume of the device increases, and the etching fluid may be disturbed by the gas flow, which disturbs the smooth and uniform flow of etching fluid and gas

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