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Production method of super-thin diamond frame saw blade matrix

A production method and diamond technology, applied in metal sawing equipment, tool manufacturing of sawing machine devices, metal processing equipment, etc., can solve the problems of insufficient rigidity and toughness of materials, and achieve the effect of reducing the consumption of steel resources

Active Publication Date: 2011-10-12
HEIXUANFENG SAW IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the problem of insufficient rigidity and toughness of the material after the thickness of the diamond frame saw blade is thinned, it is impossible to obtain an E=1.8mm ultra-thin energy-saving diamond frame saw blade base by the current conventional method

Method used

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  • Production method of super-thin diamond frame saw blade matrix
  • Production method of super-thin diamond frame saw blade matrix
  • Production method of super-thin diamond frame saw blade matrix

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Experimental program
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Embodiment

[0024] (1) Selection of material components used in the matrix: by weight percentage: C 0.75-0.85; Si<0.35; Mn<0.50; Cr0.20-0.50; S<0.030; P<0.030; Ni 1.30-2.00; the balance is iron .

[0025] (2) Material preparation: According to the material preparation of the substrate 1 in step (1), the prepared material is prepared according to the different specifications of the saw blade, and the substrate blank of the specified size is prepared; the specifications of the finished product in this example: the length is 4100mm, the width is 180mm, and the thickness is 1.8 mm. According to the specification requirements of the frame saw blade base body, prepare the blank of the frame saw blade base body with the specified size.

[0026] (3) Tension treatment: adjust the rolling position and pressure on the frame saw blade rolling machine, and control the pressure of No. 1, No. 3, and No. 5 rolling bars to 28-30kgf / cm 2 , No. 2, No. 4 rolling bar pressure 32 ~ 35kgf / cm 2 According to F...

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Abstract

The invention relates to a production method of super-thin diamond frame saw blade matrix which comprises the following steps of: selecting steel materials containing nickel to be the material of the matrix, preparing a matrix blank with a given size according to different scale requirements of saw blade; laminating the surface of the matrix blank to improve the intensity of the material; punching riveting holes at two ends of the matrix; riveting dovetail fixed plates at two ends of the matrix, so as to obtain a frame saw blade matrix 1.8 mm in thickness. In the invention, the problems that the rigidity and toughness are not enough are solved by changing material and using new tension processing method, so that the super-thin diamond frame saw blade matrix 1.8 mm in thickness is obtained, and the area of the plates produced in the grouping use process is more than 10 square meters than the plate area of the plates produced by cutting the same scale of rough stone blocks in conventional thickness diamond frame saw blade matrix; simultaneously, the weight of the matrix is reduced as the thickness of the matrix is reduced; the steel resource consumption of products and the energy consumption during the use process of the matrix are reduced, and the effect for saving energy and reducing consumption is achieved.

Description

technical field [0001] The invention belongs to the field of cutting tools, and in particular relates to a production method of an ultra-thin diamond frame saw blade substrate. Background technique [0002] At present, most of the thicknesses of diamond frame saw blade substrates used in the market are E=2.5mm and E=2.0mm, and with the increasing price and production cost of stone blocks to be processed, there is a need for a method that can improve the utilization of stone blocks. E=1.8mm ultra-thin energy-saving diamond frame saw blade substrate with high efficiency and low energy consumption to meet the needs of users. Due to the problem of insufficient rigidity and toughness of the material after the thickness of the diamond frame saw blade is thinned, the E=1.8mm ultra-thin energy-saving diamond frame saw blade substrate cannot be obtained according to the current conventional method. Contents of the invention [0003] The purpose of the present invention is to provi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23D65/00
Inventor 张云才潘天浩陈红成李仁德汪淇张卫
Owner HEIXUANFENG SAW IND
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