Masking material, piezoelectric vibrator, method of manufacturing piezoelectric vibrator, oscillator, electronic apparatus, and timepiece

Abstract

Provided are a masking material capable of suppressing the occurrence of pattern blurring when forming a pattern on a substrate by a sputtering method, a piezoelectric vibrator using the masking material, a method of manufacturing the piezoelectric vibrator, and an oscillator, an electronic device, and a radio-controlled timepiece each having the piezoelectric vibrator. A masking material which is used when forming a pattern on a substrate by a sputtering method includes openings corresponding to the pattern, and portions where the openings are not formed have a uniform thickness.

Description

technical field [0001] The present invention relates to a mask material ( mask member), a piezoelectric vibrator having an electrode pattern formed using a mask material, a manufacturing method of a piezoelectric vibrator, an oscillator having a piezoelectric vibrator, an electronic device, and a radio clock. Background technique [0002] In recent years, piezoelectric vibrators using crystals or the like as a time source, a timing source such as a control signal, a reference signal source, or the like have been used in mobile phones and portable information terminals. Various types of such piezoelectric vibrators are known, and as one of them, a surface mount type piezoelectric vibrator is known. As such a piezoelectric vibrator, there is known a piezoelectric vibrator in which a base substrate and a lid substrate are directly bonded to form a two-layer structure, and a piezoelectric vibrating piece is accommodated in a cavity formed between the two substrates. The piezoe...

AI Technical Summary

Problems solved by technology

[0008] If the mask material 280 of this structure is used for sputtering, especially when the lead-out electrodes 236, 237 are patterned on a wafer 240 with poor thermal conductivity such as glass, the heat capacity will be different between the vicinity of the opening 281 and the peripheral portion 284 of the mask material 280. , the problem that arises is that the mask material 280 expands due to heat, resulting in deflection, which is prone to pattern blurring

In particular, when the area of ​​the wafer 240 is increased, the amount of deflection becomes larger and the blur of the pattern further increases.

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