Highly-efficient radiation high-power light emitting diode (LED) packaging structure
An LED packaging and high-power technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of low LED light output rate, poor LED heat dissipation effect, and influence LED service life, etc., to increase the heat dissipation area and reduce the luminous Cost, simple and compact structure
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[0014] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0015] like figure 1 As shown: the present invention includes a transparent substrate 1 , an LED light-emitting chip 2 , a heat dissipation cavity 3 , a heat dissipation substrate 4 and a bottom plate 5 .
[0016] like figure 1 As shown: In order to efficiently dissipate the heat of the LED light-emitting chip 2 during work, the LED light-emitting chip 2 is installed on the bottom plate 5, and the bottom plate 5 is provided with a transparent substrate 1 corresponding to the side where the LED light-emitting chip 2 is arranged. The substrate 1 is pressed and covered with the LED light-emitting chip 2 . The transparent substrate 1 is pressed and covered on the LED light-emitting chip 2, which can conduct the heat of the LED light-emitting chip 2 in a timely and effective manner. The material of the transparent substrate 1 includes transparent ceramics, magnesi...
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