Method for encapsulating and manufacturing glue perfusion molded SIM (subscriber identity module) film card with flip naked chip

Abstract

The invention relates to a method for encapsulating and manufacturing a glue perfusion molded SIM (subscriber identity module) film card with a flip naked chip, which comprises the following steps of: directly flipping a thinned naked chip with a metal bump on a flexible circuit board of an SIM film card, and in a loading region of the SIM film card, using the glue to encapsulate the loading region of the flip naked chip by using the glue perfusion method. The SIM film card is produced by flipping the naked chip with the metal bump and pouring the glue, the thickness of the SIM film card and the consistency of the appearance are improved; and meanwhile, the stress state of the film card is improved due to the integral encapsulation effect of the glue so that the quality of the SIM film card is more stable and the batch processing can be realized. The film card can be prevented from damaging due to the extrusion and bending stress in the use process, so that the SIM card can be connected with the film card without holing or grooving.

Description

technical field [0001] The invention relates to a packaging and manufacturing method for a SIM film card, belonging to the technical field of electronic packaging. Background technique [0002] The SIM film card is a film card that can be pasted on the SIM card. The film card has a chip with built-in applications, and the side of the film card with pins is as image 3 It is used to contact with the contacts of the card holder of the mobile phone. The side of the film card containing the metal bumps is as figure 1 , figure 2 , used to contact with SIM card pins. After the SIM card with the SIM film card is inserted into the card holder of the mobile phone, it can be activated and start related user programs, such as security authentication, multiple mobile phone numbers and related services. [0003] Since the film card is based on the original SIM and adds the function of the SIM card, its business model and cost have a greater competitive advantage compared with the in...

AI Technical Summary

Problems solved by technology

[0006] 1. Its force is relatively concentrated. After the SIM film card is glued to the SIM and inserted into the card holder as a whole, the extrusion and bending stress will easily cause damage to the chip pins and the chip itself.

[0007] 2. SMT (Surface Mount Technology) solder placement will also increase the thickness of product molding

[0008] 3. The position of the metal bump on the SIM film card for contacting the pins of the SIM card is as follows: figure 2 The position shown, often makes it difficult to find a suitable stencil for mass brushing of solder paste, and its production efficiency is difficult to control

The protruding part of the film card chip is matched with the shape of the slot or hole on the SIM card, that is, the protruding part of the SIM film card chip is inserted into the slot or hole of the SIM card, so that the film card and the SIM card are tightly combined, which is effective The overall thickness of the SIM card with the film card attached is reduced, but due to the need to punch holes in the SIM card, the acceptance by consumers and operators is not high, and it is difficult to realize the marketization of mass products

[0010] Due to the limitations of the above reasons, it is difficult to guarantee the quality or mass production of SIM film cards, which seriously restricts the market development of SIM film cards in large quantities.

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