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Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof

A cyanide-free silver plating and electroplating solution technology, which is applied in the field of electroplating silver, can solve the problems of narrow current density range and poor stability of plating solution, and achieve the effect of excellent coverage, good stability and fine grains

Active Publication Date: 2011-08-31
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention solves the technical problems of poor stability and narrow current density range of the existing cyanide-free silver plating system; and provides a cyanide-free silver plating solution and its preparation method and electroplating method

Method used

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  • Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof
  • Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof
  • Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof

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specific Embodiment approach 1

[0011] Specific embodiment one: In this embodiment, the cyanide-free silver-plating electroplating solution is made of hydantoin derivatives, nitrogen-benzene substances, silver nitrate, potassium carbonate, potassium hydroxide and deionized water, and the cyanide-free silver-plating electroplating solution The concentration of hydantoin derivatives in the medium is 50-200g / L, the concentration of azobenzenes is 50-200g / L, the concentration of silver nitrate is 8-30g / L, and the concentration of potassium carbonate is 50-150g / L , the concentration of potassium hydroxide is 65 ~ 125g / L, nitrogen benzene substances are nitrogen benzene carboxylic acid and / or nitrogen benzene amide, the mass ratio of the total mass of hydantoin derivatives and nitrogen benzene substances to silver nitrate is 10~18:1.

specific Embodiment approach 2

[0012] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the concentration of hydantoin derivatives in the cyanide-free silver plating solution is 60-120 g / L, and the concentration of azobenzenes is 80-120 g / L. 120g / L, the concentration of silver nitrate is 10-20g / L, the concentration of potassium carbonate is 80-100g / L, and the concentration of potassium hydroxide is 85-110g / L. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0013] Specific embodiment three: the difference between this embodiment and specific embodiment one is: the concentration of hydantoin derivatives in the cyanide-free silver plating solution is 115g / L, and the concentration of azobenzenes is 100g / L. The concentration of silver nitrate is 15g / L, the concentration of potassium carbonate is 95g / L, and the concentration of potassium hydroxide is 80g / L. Others are the same as in the first embodiment.

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Abstract

The invention discloses a cyanide-free silver plating electroplating solution and a preparation method and an electroplating method thereof, belonging to the field of electrosilvering. The invention aims at solving the technical problems of poor stability and narrow current density scope of an electroplating solution in the traditional cyanide-free silver plating system. The cyanide-free silver plating electroplating solution is prepared from glycolyurea derivatives, pyridine substances, silver nitrate, potassium carbonate, potassium hydroxide and deionized water. The cyanide-free silver plating electroplating solution is prepared by adopting a mixing method. Silver plating is performed according to the electroplating method. The electroplating solution of the invention has the dispersibility ranging from 65% to 75% and good stability so that the newly-prepared electroplating solution and the electroplating solution subsequent to electroplating are free from deposition, color change and other situations after being placed for 2 months and can still be continuously used to acquire an excellent plating layer. A copper replacement experiment finds that the cyanide-free silver plating electroplating solution in the embodiment can withstand the replacement time up to more than 5 minutes. The acquired plating layer is bright and consistent in appearance, compact and flat, small in crystalline grains and strong in color change resistance. Electroplating can be performed when the current density is 0.8 to 2.0A / dm<2>.

Description

technical field [0001] The invention belongs to the field of electroplating silver; in particular, it relates to a cyanide-free silver electroplating solution, a preparation method thereof and an electroplating method. Background technique [0002] Silver has a wide range of uses in industry and daily life. It is a high-tech metal, and it is also a military and civilian dual-use metal. The electroplated silver layer has a unique silvery white luster and is chemically stable. The electroplated silver layer has high electrical and thermal conductivity, and has good soldering performance. Electroplated silver is widely used in printed circuit boards and electronic components in the electronics industry, and in important parts of communication equipment and equipment such as instrumentation, aircraft, optical instruments, high-frequency components, and waveguides to ensure good electrical conductivity. and brazing performance. In addition, electroplated silver has a beautiful...

Claims

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Application Information

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IPC IPC(8): C25D3/46
Inventor 安茂忠刘安敏杨培霞张锦秋任雪峰
Owner HARBIN INST OF TECH
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