Silicon wafer etching bath liquid isolation type uniform heating device

Abstract

The invention provides a silicon wafer etching bath liquid isolation type uniform heating device. The device comprises a heat insulation base, electric heating coils, a stainless steel plate, corrosion-resistant adhesive layers and an etching bath body, wherein grooves for the electric heating coils are distributed on the heat insulation base; the depth of the grooves is more than the diameter of the electric heating coils; the electric heating coils are distributed in the grooves; the stainless steel plate is arranged above the heat insulation base; the etching bath body is connected with the stainless steel plate in an adhesive manner by the corrosion-resistant adhesive layers; and the radiating area of the stainless steel plate is equivalent to the bottom of the etching bath. The device has the following beneficial effects: a plane type uniform heating device for the stainless steel plate is arranged at the bottom of the etching bath, the electric heating coils are arranged below the stainless steel plate, the electric heating coils firstly heat the whole stainless steel plate and then the stainless steel plate uniformly transfers the heat to the corrosive liquid in the etching bath, thus not only improving the speed of temperature rise of the liquid in the etching bath but also improving the uniformity of the temperature field.

Description

Technical field: [0001] The invention relates to monocrystalline silicon tank-type texturing equipment, in particular to a heating device in the monocrystalline silicon tank-type texturing equipment. Background technique: [0002] With the continuous improvement of solar cell production technology, new requirements are put forward for the quality and cost of solar cell products. The texturing process is the most important part in the whole process production line of solar cells. Its purpose is to remove the surface damage layer of the silicon wafer after cutting, and at the same time perform texturing treatment on the surface of the silicon wafer by chemical etching to form a good pit. The light effect reduces the surface emissivity of the silicon wafer. At present, the general production process is to use tank-type texturing equipment, add strong alkali KOH or NaOH solution into the texturing tank, and use KOH or NaOH solution to treat silicon wafers in all directions at a...

AI Technical Summary

Problems solved by technology

This local heating method makes it difficult to make the temperature field of the corrosive liquid in the texturing tank meet the temperature uniformity requirements for texturing. To make the temperature field of the corrosive liquid in the entire texturing tank meet the temperature uniformity requirements for texturing, it must Enough time to raise the temperature by convection and meet the homogenization requirements of the temperature field will not only reduce the production capacity of the texturing equipment, but also cause instability in the quality of the texturing, which cannot meet the production requirements of the large-scale texturing process

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