Anti-collision buffering device of wafer single-side polishing machine

Abstract

The invention relates to a buffering device of a polishing machine, in particular to an anti-collision buffering device of a wafer single-side polishing machine, belonging to the technical field of polishing machines. The buffering device is characterized in that an upper grinding disc rotating shaft integrated with a gas cylinder piston rod is connected with a vibration reducing transmission rod; a top stroke dead point and a bottom stroke dead point of the transmission rod are respectively provided with a damping oil cylinder which is internally provided with a reset pressure spring; and a hydraulic oil joint of each damping oil cylinder is connected on an oil storage device. In the buffering device, the structure is simple, the great gas cylinder pressure and the longer stroke can be born, the impact generated by a buffering gas cylinder at a top stroke dead point and a bottom stroke dead point reduces the impact power of a polishing head, the polishing quality of a semiconductor wafer is guaranteed, and the service life of the polishing machine is prolonged.

Description

technical field [0001] The invention relates to a buffer device for a polishing machine, in particular to an anti-collision buffer device for a wafer single-side polishing machine, and belongs to the technical field of polishing machines. [0002] The buffer device at the end of the cylinder movement allows the fast-moving cylinder to gradually decelerate and stop, so as to achieve smooth and shock-free movement. Background technique [0003] The traditional polishing machine uses cylinder movement to realize the lifting and lowering of the upper polishing head, and maintains the pressure to perform polishing. This type of traditional polishing machine is normal for the processing of common metal parts or optical parts. However, in the polishing process of semiconductor wafers, when there is no buffer, when the cylinder moves to the upper and lower ends of the stroke, an impact will occur, which will cause the consequences of breaking the polishing disc and destroying the po...

AI Technical Summary

Problems solved by technology

However, in the polishing process of semiconductor wafers, when there is no buffer, when the cylinder moves to the upper and lower ends of the stroke, an impact will occur, which will cause the consequences of breaking the polishing disc and destroying the polished wafer, which will last a long time. Time running will also damage the machine equipment, so that the polishing machine cannot work normally, so the traditional polishing machine cannot be applied to the polishing of semiconductor wafers

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