Method for preparing copper nanometer granules

Abstract

The invention discloses a method for preparing copper nanometer granules, which comprises the following steps: respectively preparing clear copper nitrate solution with concentration of 0.1-0.9 g / L, clear ethanolamine solution with concentration of 2-8g / L, and clear polyvinylpyrrolidone solution with concentration of 3-9g / L by taking low-molecular alcohol as solvent, mixing the three solutions into reaction liquid at the temperature of 60 DEG C to 80 DEG C for reaction until presenting a stable bronze color, and carrying out cooling, evaporation and drying to obtain copper nanometer granules;in the method, the reaction temperature is lower, the normal reaction can be carried out even at the temperature lower than 70 DEG C, the production cost is lower, the equipment is simple, the production is convenient, the average granule diameter of the obtained copper nanometer granules is no more than 10nm, and the copper nanometer granules are uniform monodisperse granules without binding, therefore, the material performance is better.

Description

technical field [0001] The invention relates to a method for preparing nanoparticles, in particular to a method for preparing copper nanoparticles. Background technique [0002] Because nano-copper powder (less than 100 nm) has the characteristics of small size, large specific surface area, small resistance, quantum size effect, and macroscopic quantum tunneling effect, it has some new characteristics different from conventional materials. These characteristics determine the nano-copper powder. The scope of application is very wide. For example, nano-copper powder can be directly used as a catalyst in the chemical industry (such as acetylene polymerization), and nano-copper powder can also be used as electromagnetic shielding coatings, high-grade lubricants, and electronic pastes. Nano-metal particles such as copper can be made into conductive fibers, and Cu nanoparticles can be doped in optical glass to prepare nonlinear optical materials. At the same time, nano-Cu powder ...

AI Technical Summary

Problems solved by technology

For example, the publication number is CN101104205A, and the name is the method for manufacturing copper nanoparticles and the invention patent application for copper nanoparticles manufactured by the method, which discloses that the dispersant and reducing The salt is dissolved in a polar solvent to form the second solution, and the second solution is injected hot into the first solution at one time to obtain 20-50 nm copper nanoparticles. The dispersant includes PVP (polyvinylpyrrolidone), CTAB (decabromide At least one of hexaalkyltrimethylammonium), SDS (sodium dodecyl sulfate) and NA-CMC, the reducing agent is at least one of sodium dihydrogen phosphate, hydrazine, hydrochloride and sodium borohydride, very The solvent is at least one of ethylene glycol, diethylene glycol, triethylene glycol and polyethylene glycol, and the molar ratio of copper salt to dispersant is 1:1-20. If the dispersant is less than 1 mole, it is difficult to make a uniform size. Particles, if the dispersant is larger than 20 moles, it will stick and it will be difficult to react uniformly; the molar ratio of copper salt to reducing agent is 1:2~6, if the reducing agent is less than 2 moles of copper ions, the reaction will not be complete, and if the reducing agent is greater than 6 moles, it will be wasted ;The reaction temperature is 70-120°C, below 70°C the reaction cannot be normal, and above 120°C the stability of the reaction liquid decreases and the particles are uneven

The amount of dispersant used in this method is large, the reaction temperature is high, and the copper nanoparticles obtained are relatively large.