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Multi-layer film deposition method

A technology of multi-layer thin film and deposition method, applied in coating, metal material coating process, ion implantation plating, etc., can solve problems such as uneven thickness, and achieve the effect of improving control accuracy

Inactive Publication Date: 2011-06-15
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for preparing titanium / titanium nitride multilayer films by accurately and automatically controlling the flow of multiple gases, which solves the problem of manual control of gas flow in the multilayers caused by arc ion plating. The problem of uneven thickness of the unit layer, the method of controlling the gas flow is to use the gas mass flow controller to realize the alternate feeding of multiple gases such as argon and nitrogen, so as to ensure the precise control of the thickness of the unit layer, so that the deposited Ultra-hard multilayer films meet demands for increased hardness and wear resistance

Method used

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Examples

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Effect test

Embodiment 1

[0033] The substrate is made of high-speed steel (grade W18Cr4V), the size of the sample is 20mm×10mm×10mm, and the size of the coated surface is 20mm×10mm. The surface before coating is ground, polished, ultrasonically cleaned and dried, and then placed on the sample stage of the vacuum chamber until the vacuum degree in the vacuum chamber reaches 5×10 -3 At Pa, turn on the gas mass flow controller, pass argon gas to 2.0 Pa, apply DC negative bias to -800V on the substrate, and perform glow cleaning on the sample for 10 minutes; then, adjust the Ar gas flow rate to adjust the vacuum chamber pressure to 0.5 Pa, open the titanium arc at the same time, the arc current is stable at 70A, and the Ti + Ion bombardment for 5 minutes; after that, enter the multi-layer film deposition process, first adjust the substrate bias to -400V range, set the air pressure to 0.5Pa; open figure 1 The gas mass flow controller shown in the figure uses a time relay to set the flow rate and time of a...

Embodiment 2

[0036] The base material is cemented carbide (grade YG6), the size of the sample is 20mm×10mm×10mm, and the size of the coated surface is 20mm×10mm. The surface before coating is ground, polished, ultrasonically cleaned and dried, and then placed on the sample stage of the vacuum chamber until the vacuum degree in the vacuum chamber reaches 4×10 -3 At Pa, turn on the gas mass flow controller, pass argon gas to 1.0Pa, apply DC negative bias to -600V on the substrate, and perform glow cleaning on the sample for 8 minutes; then, adjust the Ar gas flow rate to adjust the vacuum chamber pressure to 0.6 Pa, open the titanium arc at the same time, the arc current is stable at 80A, and the sample is subjected to Ti + Ion bombardment for 3 minutes; after that, enter the multi-layer film deposition process, first adjust the substrate bias to -200V range, set the air pressure to 0.6Pa; open figure 1 The gas mass flow controller shown in the figure uses a time relay to set the flow rate ...

Embodiment 3

[0039] The substrate is made of high-speed steel (grade W6Mo5Cr4V2Al), the size of the sample is 20mm×10mm×10mm, and the size of the coated surface is 20mm×10mm. The surface before coating is ground, polished, ultrasonically cleaned and dried, and then placed on the sample stage of the vacuum chamber until the vacuum degree in the vacuum chamber reaches 3×10 -3 At Pa, turn on the gas mass flow controller, pass argon gas to 1.0 Pa, apply DC negative bias to -500V on the substrate, and perform glow cleaning on the sample for 5 minutes; then, adjust the Ar gas flow rate to adjust the vacuum chamber pressure to 0.3 Pa, open the titanium arc at the same time, the arc current is stable at 80A, and the sample is subjected to Ti + Ion bombardment for 4 minutes; after that, enter the multi-layer film deposition process, first adjust the substrate bias to -300V range, set the air pressure to 0.3Pa; open figure 1 The gas mass flow controller shown in the figure uses a time relay to set ...

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Abstract

The invention belongs to the technical field of the surface deposition of a superhard multi-layer coating on a metal material, and specifically relates to a titanium / titanium nitride multi-layer film deposition method which solves the problem of great thickness fluctuation of each unit layer in the multi-layer film deposition process based on common arc ion plating. The method comprises the following steps: (1) by alternately introducing gas, accurately controlling the flow and introducing time of the gas; and (2) depositing a metal / metal nitride multi-layer film on the surface of a workpieceby the arc ion plating technology. By using a gas mass and flow controller, multi-way gas of argon gas and nitrogen gas can be alternately introduced, the gas flow and the alternate gas introducing time can be accurately controlled, and the gas flow value and the corresponding deposition time can be set, so that a multi-layer film with 60 layers can be deposited. The alternate gas flow control technology can ensure that the thickness and mass of each unit layer of the multi-layer coating can be effectively controlled, thereby greatly enhancing the unit layer thickness control accuracy of the multi-layer film and effectively improving the performance of the multi-layer film.

Description

Technical field: [0001] The invention belongs to the technical field of depositing a superhard multilayer coating on the surface of a metal material, in particular to a deposition method of a titanium / titanium nitride multilayer film. It is in the same vacuum chamber, by alternately feeding different gases and turning on the arc evaporation source to deposit superhard multilayer films, which can achieve precise control of the thickness of the multilayer films to improve the hardness and wear resistance of the multilayer films. Background technique: [0002] At present, the deposition of multi-layer films generally adopts the method of rotating the workpiece to the corresponding target (such as pure titanium or chromium target), or alternately passing different gases (such as Ar and N 2 ) and other methods, can realize the deposition of multi-layer films (the former such as TiN / CrN, the latter such as Ti / TiN). However, for Ti / TiN-type metal / nitride (or other hard materials s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/54C23C14/22C23C14/06
Inventor 赵彦辉肖金泉郎文昌于宝海华伟刚高立军
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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