Light emitting diode (LED) high-power encapsulation silica gel

Abstract

The invention relates to a light emitting diode (LED) high-power encapsulation silica gel, which consists of gel A and gel B in parts by weight, wherein the gel A comprises an ingredient of a resin part, and the gel B comprises an ingredient of a cross linking agent part, wherein the gel A comprises ingredients consisting of 100 parts of vinyl phenyl polysiloxane, 50 to 100 parts of vinyl polysiloxane and 0.02 to 2 parts of catalysts, the gel B comprises ingredients consisting of 100 parts of hydrogen phenyl polysiloxane, 50 to 100 parts of hydrogen polysiloxane and 0.01 to 2 parts of polymerization inhibitors, catalysts are platinum catalysts with the platinum content between 1000 and 7000ppm, and the polymerization inhibitors are alkynol substances. The LED high-power encapsulation silica gel provided by the invention adopts the storage modes of the gel A and the gel B, the production process is simple and can be easily implemented, the storage is convenient without special requirements, the storage life is long, and the silica gel is favorable for production. In the use process, the silica gel formed through simple mixing has the advantages of strong bonding force, high intensity, high light transmission rate, good light refractivity and excellent high-temperature-resistance and aging-resistance capability.

Description

technical field [0001] The invention relates to an organic silica gel and a preparation method thereof, in particular to a high-power encapsulation silica gel used for packaging Led lighting lamps and a preparation method thereof. Background technique [0002] In the field of optoelectronic device packaging, polymer materials are used as packaging materials for optoelectronic devices due to their advantages such as good mechanical properties and low price. Silicone polymer materials have attracted widespread attention due to their advantages of corrosion resistance, heat resistance, high transparency, and the ability to produce materials with different mechanical properties from soft gels to hard resins. However, as a widely used packaging material, polymer materials also have their inherent disadvantages, that is, very low thermal conductivity and low high temperature resistance. This has no effect on the packaging of low-power optoelectronic devices, but the heat generate...

AI Technical Summary

Problems solved by technology

Due to the low thermal conductivity of polymer packaging materials, the heat generated by optoelectronic devices cannot be dissipated in time, and the heat will accumulate inside the optoelectronic devices, which will affect the normal operation of optoelectronic devices. Therefore, strong heat dissipation devices have become an important research and development of optoelectronic devices. object, but the research and development of high temperature resistant silicone materials is relatively lagging behind

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