Method for making and packaging printed circuit board (PCB) and crystal oscillator

Abstract

The invention discloses a method for making and packaging a printed circuit board (PCB). The method comprises the following steps of: providing the PCB, wherein, the PCB is provided with at least one circuit area, and a packaging area is closely arranged around the circuit area; milling the packaging area so as to form a groove between the packaging area and the circuit area; carrying out electroless copper plating in the circuit area and metallization treatment in the packaging area; etching the circuit area according to circuit layout, and arranging components on the circuit area; providing a metal cover body, arranging the lower end of the metal cover body in the groove formed between the packaging area and the circuit area, wherein the circuit area is in the metal cover body; and welding the lower end of the metal cover body with the groove. The invention further discloses a crystal oscillator with the PCB.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for manufacturing a printed circuit board, a packaging method, and a crystal oscillator with the printed circuit board. Background technique [0002] In electronic products and related industries (such as the crystal oscillator industry), various electronic components need to be electrically connected to transmit power signals, data signals, etc. Packaging is critical. Based on some devices with relatively little usage and high frequency and high stability, it is difficult to realize chip-scale packaging. Usually, the manufacturers of related products will arrange the circuits with specific functions on a printed circuit board (PCB board), and after debugging and testing, they will be packaged into a single device for sale. Now the production process is mainly surface mount, so after the product is formed, the surface mount device is the main one. Surface mount d...

AI Technical Summary

Problems solved by technology

However, in the process of PCB board processing, such as reflow soldering of surface mount components, the positioning and fixing method of the metal cover has become a difficult problem in the industry. At present, the fixing method of the metal cover on the market adopts the direct welding method, which is expensive. , and the defective rate is high, which is not conducive to the realization of high-efficiency and high-quality PCB board manufacturing process

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