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Chip-like electric component and method for manufacturing same

A technology of electrical components and electrical components, applied in the direction of electrical components, resistance manufacturing, resistor parts, etc.

Inactive Publication Date: 2014-03-12
HOKURIKU ELECTRIC INDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in a resistor with a relatively small size, there are cases where the electrodes and the resistor body are formed only by thin film formation technology.

Method used

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  • Chip-like electric component and method for manufacturing same
  • Chip-like electric component and method for manufacturing same
  • Chip-like electric component and method for manufacturing same

Examples

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Embodiment Construction

[0022] Hereinafter, embodiments of the chip-shaped electrical component of the present invention will be described in detail with reference to the drawings. figure 1 It is a cross-sectional view schematically showing the structure of a chip resistor 1 which is one type of chip-like electrical component manufactured by the manufacturing method of the chip-like electrical component of the present invention. figure 1 This is a cross-sectional view schematically shown for easy understanding, and the dimensional ratio of each part, the thickness and shape of each layer are different from those of an actual member. figure 2 (A) to (F) are shown figure 1 A process diagram of a plurality of steps in the manufacturing method of the chip resistor 1 according to the embodiment. use figure 2 process diagrams, while describing the manufacturing method of the chip resistor 1 of this embodiment, together with figure 1 The structure of the chip resistor 1 will be described.

[0023] exi...

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PUM

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Abstract

A chip-like electric component such as a chip resistor is provided, which is easy to manufacture and in which cracks or fractures of an insulating substrate are unlikely to occur. A pair of surface electrodes 21, 23 are formed so that thicknesses of the pair of surface electrodes increase from a resistor layer 13 toward end portions 30 of an insulating substrate 29 in a direction in which the pair of surface electrodes 21, 23 are arranged. A plating reservoir S is formed between one of the surface electrodes 21, 23 and an insulating protective layer 15. When forming at least one plated layer 33, a plated metal pools in the plating reservoir S. The at least one plated layer 33 may work to reduce to some extent a height difference between a soldering electrode portion 21, 23, 27, 33 and the insulating protective layer 15.

Description

technical field [0001] The present invention relates to a chip-shaped electrical component and a manufacturing method thereof. Background technique [0002] In chip resistors, which are one type of relatively large chip-shaped electrical components, resistors and the like are formed with thick films, and all electrodes for soldering are also formed with thick films. In addition, in a resistor having a relatively small size, electrodes and resistors may be formed only by a thin film forming technique. In addition, in resistors with a relatively small size, soldering electrodes may be formed by a combination of a thick film and a thin film. [0003] In the method of manufacturing a chip resistor described in Japanese Unexamined Patent Application Publication No. 63-172401 (Patent Document 1), in order to obtain individual chip substrates, an alumina substrate for multiple acquisition that can be cut and separated is used. First, a plurality of thick-film resistor layers made...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/00H01C1/012H01C17/06
CPCH01C17/06506H01C17/006H01C7/003H01C1/06Y10T29/49155
Inventor 竹内胜己野村丰黑川宽幸
Owner HOKURIKU ELECTRIC INDS
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