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Dustproof film assembly and framework thereof

A technology of dust-proof film components and frames, which is applied in the fields of electrical components, components for photomechanical processing, semiconductor/solid-state device manufacturing, etc., and can solve problems such as high price, poor processability, and increased cost

Inactive Publication Date: 2011-05-11
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these basic materials are expensive and have poor processability, which will greatly increase the cost and are difficult to adopt in reality

Method used

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  • Dustproof film assembly and framework thereof
  • Dustproof film assembly and framework thereof
  • Dustproof film assembly and framework thereof

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Experimental program
Comparison scheme
Effect test

Embodiment

[0100] Hereinafter, the present invention will be specifically illustrated and described based on examples, but the present invention is not limited thereto.

[0101] (Example)

[0102] produced by machining figure 2 The aluminum alloy pellicle frame 11 of the shape shown is shown. The shape of this pellicle frame 11 is that the outer size of each corner is 1068mm × 1526mm, the inner size of the same part is a rectangle of 1031mm × 1490mm, and the thickness H is 6.2mm. The size of each corner is R2 on the inside and R2 on the outside. R6. Here, on both ends of the long sides, such as figure 2 (a)~ figure 2 As shown in (d), the concave portion 12 having a width h=2.4 mm, a depth d=4.0 mm, and a radius of the deepest part of 1.2 mm is provided along the length l=65 mm.

[0103] After the pellicle frame 11 was cleaned and dried, a silicone adhesive was applied as a pellicle adhesive on one end surface, and a silicone adhesive manufactured by Shin-Etsu Chemical Co., Ltd. w...

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PUM

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Abstract

The invention provides a dustproof film assembly and a framework thereof.Due to the dustproof film assembly framework adopted by the dustproof film assembly, adverse conditions caused by tension difference and the small bending thereof due to the tension force of the dustproof film are avoided.According to the invention, the dustproof film assembly framework extending from both ends toward the middle point thereof is arranged at the outer sides of at least one pair of opposite edges of the frame body, which does not pass through the recess portion.The dustproof film assembly is arranged on the dustproof film assembly framework, wherein the recess portion is preferably arranged on a longer pair of sides or on all sides.

Description

technical field [0001] The present invention relates to a pellicle frame used for a pellicle for photolithography used as a dustproof device in the manufacture of semiconductor devices such as LSI and super LSI, printed substrates, and liquid crystal display panels, and the use of the pellicle Frame pellicle assembly. Background technique [0002] In the manufacturing process of semiconductor devices such as LSI and super LSI, or liquid crystal display panels, semiconductor wafers or original plates for liquid crystals are irradiated with light to form patterns. It will absorb light and reflect light. In addition to deforming the transferred pattern and roughening the edges, it will also make the base black and damage the size, quality, and appearance. In addition, in this invention, an "exposure original plate" is a generic term for masks for lithography such as photomasks (abbreviated as "mask") and shrink masks. [0003] Therefore, these operations are usually carried o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/14H01L21/027G03F1/64
CPCG03F1/62G03F1/64G03F1/66H01L21/0274
Inventor 关原一敏
Owner SHIN ETSU CHEM IND CO LTD
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