Packaging locating device of microchannel lamination laser

Abstract

The invention discloses a packaging locating device of a microchannel lamination laser, comprising a square base and a locating device for fixing a microchannel unit, and a compass and a regulating device, the compass is in a round structure which is provided with an opening at the center and is rotational, round holes are uniformly distributed at the periphery of the compass, and the compass is fixed at one side of the base by a locking screw; the locating device comprises a bottom part locating part, a top part locating part, a rear locating plate, a front locating plate, a lifting rod and the bottom surface of a lifting device, the top part locating part is articulated with the top part of the rear locating plate, the rear locating plate and the front locating plate are fixed on the bottom surface of the L-shaped bottom part locating part side by side, a round hole at the bottom part of the bottom part locating part is nested with the lifting rod, the lifting rod is fixed on the bottom surface of the lifting device, and one end of the bottom surface of the lifting device is fixed on the compass. In the invention, the assembly, inspection and fine-tuning processes of the microchannel lamination laser are integrated, the whole process is simple and easy, the assembling precision is improved, and the light beam directivity is improved.

Description

technical field [0001] The invention relates to semiconductor optoelectronic device packaging equipment, in particular to a microchannel lamination laser packaging positioning device. Background technique [0002] High-power semiconductor lasers have been more and more widely used in solid-state laser pumping, laser processing, laser medical treatment, laser display and military applications, especially in solid-state laser pumping applications, due to their small size and light weight, It is favored for its high efficiency and reliability. In the past ten years, with the further optimization of the chip structure of high-power semiconductor lasers and the increase in demand in industrial processing, military and other fields, different packages such as laser bar arrays and stacked arrays with output powers of thousands of watts or even tens of thousands of watts The difficulty of form design and assembly is more prominent. [0003] In practical applications, semiconductor...

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Problems solved by technology

[0004] The shortcomings of the above-mentioned assembly process are mainly manifested in the following aspects: ① There is no special assembly fixture yet, and there are many human-influenced factors in the assembly process, so the assembly inconsistency is serious, which affects the quality of the product; ② After assembly, the pointing angle and pitch of the stack The angle is not easy to adjust. If adjustment is required, the fixture can only be disassembled and then positioned, which affects assembly efficiency and accuracy. At the same time, it may bring other potential hazards such as damage to the microchannel unit, which will lead to the failure of the stacked laser

The above problems have seriously affected the accuracy, efficiency and reliability of stacked laser packaging

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