Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Trimethyl-silyl polysilsesquioxane particle reinforced type tin-silver-copper composite soldering paste and preparation method thereof

A technology of polysilsesquioxane and trimethylsilyl, applied in welding equipment, manufacturing tools, welding media, etc., can solve interface cracking, difficulty in achieving ideal uniform distribution of reinforcement phase, and poor combination of reinforcement phase and matrix structure and other problems, to achieve the effect of improving mechanical properties, inhibiting formation and growth

Inactive Publication Date: 2011-04-20
CHONGQING UNIV
View PDF4 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the reinforcement phases such as nanoparticles and fibers have extremely high surface energy, which makes them easy to "agglomerate", making the ideal uniform distribution of reinforcement phases in composite solder alloys very difficult to achieve
In addition, the problem of poor wetting between ceramic and inert metal nanoparticles and solder alloys leads to poor bonding between the reinforcing phase and the matrix structure (prone to interface cracking) is very difficult
These disadvantages limit the wide application of composite lead-free solder alloys

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Trimethyl-silyl polysilsesquioxane particle reinforced type tin-silver-copper composite soldering paste and preparation method thereof
  • Trimethyl-silyl polysilsesquioxane particle reinforced type tin-silver-copper composite soldering paste and preparation method thereof
  • Trimethyl-silyl polysilsesquioxane particle reinforced type tin-silver-copper composite soldering paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0014] Firstly, the trimethylsilyl polysilsesquioxane particles with a mass ratio of 1% and the no-clean flux are put into a beaker, and after mixing, shake in an ultrasonic cleaner for 1 hour to uniformly disperse the trimethylsilyl polysilsesquioxane. The semisiloxane particles form a slurry. Then put the tin-silver-copper solder paste into a beaker and stir the dispersed slurry by hand for 30 minutes to ensure that the trimethylsilyl polysilsesquioxane particles are evenly mixed with the solder paste to obtain a composite trimethyl Silanyl polysilsesquioxane particle reinforced tin-silver-copper composite solder paste.

example 2

[0016] First, the 2% mass ratio of trimethylsilyl polysilsesquioxane particles and no-clean flux are put into a beaker, and after mixing, shake in an ultrasonic cleaner for 1 hour to uniformly disperse trimethylsilyl polysilsesquioxane. The semisiloxane particles form a slurry. Then put the tin-silver-copper solder paste into a beaker and stir the dispersed slurry by hand for 30 minutes to ensure that the trimethylsilyl polysilsesquioxane particles are evenly mixed with the solder paste to obtain a composite trimethyl Silanyl polysilsesquioxane particle reinforced tin-silver-copper composite solder paste

example 3

[0018] Firstly, the trimethylsilyl polysilsesquioxane particles with a mass ratio of 3% and the no-clean flux are put into a beaker, and after mixing, shake in an ultrasonic cleaner for 1 hour to uniformly disperse the trimethylsilyl polysilsesquioxane. The semisiloxane particles form a slurry. Then put the tin-silver-copper solder paste into a beaker and stir the dispersed slurry by hand for 30 minutes to ensure that the trimethylsilyl polysilsesquioxane particles are evenly mixed with the solder paste to obtain a composite trimethyl Silanyl polysilsesquioxane particle reinforced tin-silver-copper composite solder paste.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses trimethyl-silyl polysilsesquioxane particle reinforced type tin-silver-copper composite soldering paste and a preparation method thereof, belonging to a composite lead-free solder technology. A composite solder comprises 1-5 percent by weight of trimethyl-silyl polysilsesquioxane particle in tin-silver-copper solders with a weight ratio of 96.5:3:0.5. The preparation method of the solder comprises the following steps of: firstly, putting the 1-5 percent by weight of trimethyl-silyl polysilsesquioxane particle and a no-clean flux into a breaker; putting the breaker in an ultrasonic wave cleaner and shaking the mixture for 1 hour in the ultrasonic wave cleaner; adding tin-silver-copper soldering paste; manually stirring for 30 minutes to prepare the composite soldering paste; putting the composite soldering paste on a ceramic substrate; putting the ceramic substrate in a refluxing furnace and refluxing the ceramic substrate at maximum temperature of 538K in the refluxing furnace to obtain a trimethyl-silyl polysilsesquioxane particle reinforced type tin-silver-copper composite solder. In the prepared composite solder, a matrix of beta-Sn phase is thinned, and the growth of an Ag3Sn phase is inhibited.

Description

Technical field [0001] The invention relates to a trimethylsilyl polysilsesquioxane particle-reinforced tin-silver-copper composite solder paste and a preparation method thereof, belonging to composite lead-free solder paste technology. Background technique [0002] Electronic packaging is a bridge connecting semiconductor chips and electronic systems, which is one of the key links to achieve reliable service of electronic devices. Among them, the solder alloy as the connection material provides the necessary electrical, thermal and mechanical connections for electronic devices, and its soldering performance directly affects the service life of the entire electronic device. Traditional lead-tin solder is widely used in modern electronic assembly industry with its excellent performance and low price. However, with the strengthening of human environmental protection awareness, the harm of lead and its compounds to the human body and the pollution to the environment have been paid ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/362C08L83/04
Inventor 沈骏陈洁
Owner CHONGQING UNIV
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com