Manufacturing method of sandwich plate

Abstract

The invention relates to a manufacturing method of a sandwich plate, comprising the following steps of: 1, providing a plurality of prepregs, collocating the prepregs according to required thicknesses, and coating release films on double surfaces; 2, heating and pressing the prepregs with the double surfaces coated with the release films through a pressing machine; 3, when the prepregs are in high-temperature molten states and start to carry out curing reaction, stop heating before materials are completely cured, wherein the prepregs already reach a procuring stage at the time so as to become insulating reinforcing plates with lower curing degree; and 4, substituting the insulating reinforcing plates with lower curing degree for the prepregs to be used for manufacturing the sandwich plate so as to manufacture the sandwich plate with uniform interlaminar thickness. The invention substitutes the insulating reinforcing plates with lower curing degree for the prepregs to be used for producing the sandwich plate, thereby not only solving the problems of large gummosis of press plates and the like and having good interface bonding force, but also fitting to the low-carbon economic concepts, i.e. low cost, low energy consumption and low pollution.

Description

technical field [0001] The present invention relates to the fields of copper clad laminates (CCL) and printed circuit boards (PCB), in particular to a method of manufacturing multi-layer boards by applying insulation-reinforced boards with a low curing state between prepreg and cured copper clad laminates (or insulating boards). method. Background technique [0002] With the continuous development of "thin, light and small" electronic products, high-density interconnect (HDI) multilayer boards continue to pursue thinning, making printed circuit boards continue to develop in the direction of high-layer and high-density circuit distribution. The impedance design in the multilayer board determines the thickness of the dielectric layer of the multilayer board, and the dielectric layer between the core boards is realized through the combination of prepregs. When multiple prepreg pressing plates are used at the same time, it is easy to have many problems such as large flow of glu...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a method for making multi-layer boards, which uses low-cured insulation-reinforced boards to replace prepregs for multi-layer board production, which can not only solve the problems of large glue flow on the pressing boards, but also have good interface bonding. In line with the concept of low-carbon economy with low cost, low energy consumption and low pollution

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