Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

SOPC (system on programmable chip) software and hardware cooperative system based on Linux

A technology of software and hardware collaboration and working system, applied in the direction of multi-programming devices, etc., can solve the problem of less software functions

Inactive Publication Date: 2011-04-06
SHANGHAI JIAO TONG UNIV
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can realize software-hardware cooperative work, it is a pure software system based on SOPC and a non-operating system-based software-hardware cooperative work system, and the software functions that can be realized are relatively small and relatively simple.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • SOPC (system on programmable chip) software and hardware cooperative system based on Linux
  • SOPC (system on programmable chip) software and hardware cooperative system based on Linux

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The following describes the embodiments of the present invention in detail. This embodiment is implemented on the premise of the technical solution of the present invention, and provides detailed implementation modes and specific operation procedures, but the protection scope of the present invention is not limited to the following implementations example.

[0019] Such as figure 1 As shown, this example includes: SOPC module 1, Linux system module 2 on the development board, and server module 3 on the network server, where SOPC module 1 is connected to Linux system module 2 and transmits hardware device request information and module response information, SOPC module 1 is connected with Linux system module and transmits development and debugging information, Linux system module 2 is connected with network server module 3 and transmits Linux system IP address, network configuration information and network file system, SOPC module 1 is connected with network service module ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an SOPC (system on programmable chip) software and hardware cooperative system based on Linux, which comprises an SOPC module, a Linux system module and a network server module, wherein the Linux system module comprises a Linux kernel module and a Linux driver module, the network server module comprises a DHCP (dynamic host configuration protocol) server module and an NFS (network file system) server module, and the NFS server module comprises a file system mounting module and a file system interactive module. In the system of the invention, the SOPC and the NFS file system Linux are combined, and the software and hardware cooperative design system based on the combination is realized. The system of the invention has the advantages of fast development flow and simple implementation and is convenient in operation and easy in transplantation and expandability.

Description

Technical field [0001] The invention relates to a device in the technical field of computer operating systems, in particular to a Linux-based SOPC (System-on-a-Programmable-Chip Programmable Chip System) software and hardware cooperative working system. Background technique [0002] At present, with the rapid development of the semiconductor industry, SOPC, as a new form of embedded systems, has been widely used. Using SOPC technology to achieve embedded hardware acceleration, as an emerging system solution model, has its huge development power and broad application prospects. To achieve the above requirements, the collaborative design of software and hardware and the development of IP hard cores are essential . [0003] In some specific applications, pure software system improvement can no longer meet the performance acceleration requirements. At this time, the original software system can be accelerated by re-dividing the hardware and software. The original software is more time...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F9/46
Inventor 孙宜进朱杰蓝维洲
Owner SHANGHAI JIAO TONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products