LED heat radiator and local nickel plating device and local nickel plating method thereof

Abstract

The invention relates to an LED heat radiator and a local nickel plating device and a local nickel plating method thereof, in particular to an LED heat radiator and a local film plating device and method thereof. At present, the nickel plating of heat radiators is carried out in a mode of integral plating solution immersion, plating prevention treatment is carried out on a surface needing not to be plated with nickel, and after the surface is plated, the plating prevention treatment can be eliminated. Time and energies are wasted, and plating solutions are wasted. The local nickel plating device is characterized by comprising a liquid storage tank, an acid-proof pump, a hot water tank, a return pipe and a liquid injection pipe, wherein the acid-proof pump is used for realizing the circulation of the nickel solution, the hot water tank is used for soaking the LED heat radiator, the return pipe is connected with the hot water tank, a liquid outlet of the liquid injection pipe is arranged above an illuminant thermal conductive surface, a liquid inlet of the return pipe is matched with a liquid outflow pipeline of the LED heat radiator for withdrawing the nickel solution flowing through the illuminant thermal conductive surface to the liquid storage tank, and the liquid inlet of the return pipe is sleeved with a seal ring capable of being butted on the liquid outflow pipeline. The local nickel plating only aims at a working surface, and therefore the nickel solution is saved. The nickel plating method has the advantages of saving the former sequence processing time and the later sequence processing time and reducing the production cost because the appearance needing not to be plated with the nickel needs not to be protected.

Description

technical field [0001] The invention relates to an LED radiator, a local metal coating device and a local metal coating method thereof. Background technique [0002] At present, the heat-conducting surface of the light source in the LED radiator is covered with a silver glue layer, but due to the large heat dissipation of the LED chip, the local temperature is high, and the thermal expansion coefficient of the silver glue layer is different from that of the base, the thermal stress is large, and the silver glue layer is easy to In addition, the silver glue layer is also easy to age and has a large thermal resistance. The above aspects limit the use range and service life of the LED lamp. It is especially not suitable for high-power LED lights. Nickel plating gradually replaces the silver glue layer. Before nickel plating, it is necessary to paste anti-plating stickers on the surface that does not need nickel plating, and then immerse the parts to be plated in the plating sol...

AI Technical Summary

Problems solved by technology

[0002] At present, the heat-conducting surface of the light source in the LED radiator is covered with a silver glue layer, but due to the large heat dissipation of the LED chip, the local temperature is high, and the thermal expansion coefficient of the silver glue layer is different from that of the base, the thermal stress is large, and the silver glue layer is easy to In addition, the silver glue layer is also easy to age and has a large thermal resistance. The above aspects limit the use range and service life of the LED lamp. It is especially not suitable for high-power LED lights. Nickel plating gradually replaces the silver glue layer. Before nickel plating, it is necessary to paste anti-plating stickers on the surface that does not need nickel plating, and then immerse the parts to be plated in the plating solution and connect the power supply. Since the LED base needs to be nickel-plated only the heat-conducting surface of the light source, other parts need to be coated. All surfaces are carefully covered with anti-plating stickers. After plating, the anti-plating stickers have to be torn off, which takes a lot of time. When the LED base is integrally connected with heat dissipation fins, the workload will be more, which will affect production efficiency. Increase the production cost. At the same time, during electroplating, the entire plated part is placed in the plating solution. After the nickel plating is completed, the surface of the removed plated part will inevitably stick to the plating solution. If it is not good for shielding, it will also be covered with a nickel layer, wasting the plating solution.

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