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Plasma processing apparatus

A plasma and treatment device technology, applied in the field of plasma treatment devices, can solve the problems of electrode damage, shape deformation of discharge space, electrode deformation, etc., and achieves the effects of not easy insulation breakdown, improved stability, and suppression of deformation.

Inactive Publication Date: 2011-01-26
松下电工神视株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the plasma processing apparatus as described above, if the positioning of the facing electrodes is incorrect, or the electrodes are deformed due to the heat generated by the plasma discharge, so that the shape of the discharge space is deformed, the following problems may occur. That is, the expected performance cannot be obtained, or the electrode may be damaged due to the cessation of discharge, abnormal discharge, or abnormal discharge concentration.
[0006] In addition, when the electrodes of the above-mentioned plasma processing apparatus are used, thermal expansion or the like occurs due to the heat of plasma discharge, and deformation occurs to some extent.
However, after the facing electrodes are fixed by a fixing unit such as a screw, the part of the electrode located around the fixing unit is fixed by the fixing unit, so it cannot be thermally deformed.
Therefore, there is a problem that, in one electrode, there is a difference in the amount of deformation between the periphery of the fixed unit and the position other than the fixed unit, and the shape of the discharge space is easily deformed.

Method used

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Embodiment approach 1

[0062] refer to Figure 1 to Figure 5(a) , FIG. 5(b) to describe the first embodiment of the present invention. The up and down directions in the following descriptions correspond to figure 2 in the up and down direction.

[0063] figure 1 , figure 2 An example of the plasma processing apparatus A of this embodiment is shown. This plasma processing apparatus A includes a discharge vessel 30 composed of a plurality of coated electrodes 3 facing each other, a power source 5, and a heat sink 6 .

[0064] The covered electrode 3 is formed by embedding the conductive layer 2 in a substantially flat insulating substrate (multilayer substrate) 1 . The insulating substrate 1 is a substrate formed by a ceramic (ceramic) sintered body of an insulating material (dielectric material) with a high melting point. Mullite, aluminum nitride, and other high-heat-resistant, high-strength ceramic sintered bodies are formed, but are not limited to these materials. It is particularly prefe...

Embodiment approach 2

[0087] refer to Figure 6 Next, a second embodiment of the present invention will be described. In this embodiment, a cooling fan (fan) 63 is provided around the heat dissipation fins 62 as cooling means, and other configurations are the same as in the first embodiment. Components common to those in Embodiment 1 are denoted by the same reference numerals and descriptions thereof are omitted.

[0088] In this embodiment, the cooling fan 63 is provided so as to face the heat dissipation fins 62 . In the present embodiment, by operating the cooling fan 63, the coated electrode 3 can be cooled more efficiently and the coated electrode 3 can be cooled more efficiently than only the cooling fins 62 are used to cool the coated electrode 3. The possibility that the cover electrode 3 is damaged or the like is reduced. It should be noted that the operation and stop of the cooling fan 63 can be controlled as necessary based on the measurement result of the temperature of the insulatin...

Embodiment approach 3

[0090] refer to Figure 7 Next, a third embodiment of the present invention will be described. In this embodiment, the heat sink 6 is formed with a cooling jacket 64 instead of the contact portion 61 and the heat radiation fin 62 , and other configurations are the same as those of the first embodiment. Components common to those in Embodiment 1 are denoted by the same reference numerals and descriptions thereof are omitted.

[0091] Such as Figure 7 As shown, the cooling jacket 64 of this embodiment is also pierced with a positioning hole B communicating with the spacer portion 31 of the coated electrode 3 . Furthermore, as in the first embodiment, the covered electrode 3 and the cooling jacket 64 are brought into pressure contact with each other by the bolt 71 , the nut 72 and the coil spring 73 .

[0092] The cooling jacket 64 is formed in a plate shape with the same material as the heat dissipation fins 62 in Embodiment 1, and a circulation path for circulating a refrig...

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Abstract

The invention discloses a plasma processing apparatus, which is provided with a positioning hole (B) in communication with a cladding electrode (3) and a radiator (6). A bolt (71) is inserted through the positioning hole (B) to correctly and easily realize the positioning of the cladding electrode (3). Additionally, a spiral spring (73) is arranged between the head (71a) of the bolt (71) and the radiator (6). In this way, a clearance caused by elastic force of the spiral spring (73) is present between the head (71a) and the radiator (6). As a result, the cladding electrode (3) can be deformed.

Description

technical field [0001] The present invention relates to a plasma processing device, which is used for cleaning (cleaning), stripping and etching (etching) of photoresist (photoresist, resist), organic Improvement of film adhesion, reduction of metal oxides, film formation, plating pretreatment, coating pretreatment, coating pretreatment, surface modification of various materials and parts, etc. In processing, the plasma processing apparatus is particularly suitable for cleaning the surface of electronic parts requiring precision bonding. Background technique [0002] In the prior art, a plurality of electrodes are arranged facing each other, the space between the electrodes is formed as a discharge space, gas for generating plasma (plasma) is supplied to the discharge space, and a voltage is applied between the electrodes. In this way, a discharge is generated in the discharge space to generate plasma, and the plasma or active species of the plasma is ejected from the disch...

Claims

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Application Information

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IPC IPC(8): H05H1/24H05H1/28
CPCH01J37/32559
Inventor 中园佳幸弓削政郎
Owner 松下电工神视株式会社
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