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Photocurable composition for embossing and method for producing cured products

A curable composition, molding technology, applied in photosensitive materials for opto-mechanical equipment, photolithographic process exposure devices, optics, etc., can solve the problem of insufficient adhesion, unsuitable optical materials, unsuitable optical materials problem, to achieve the effect of excellent optical lens

Inactive Publication Date: 2011-01-05
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after studying the composition described in the above-mentioned Patent Document 2, the present inventors found that the adhesion to the substrate was not sufficient, and dirt was easily attached to the stamper, requiring frequent cleaning.
In addition, it was found that when heat treatment is performed at 220°C for curing, it will be colored yellow, which is not suitable as an optical material.
In addition, the inventors of the present invention, after studying the composition described in Patent Document 3, found that the photocurable composition had defects caused by bubbles due to coating, poor stamper release properties after photocuring, and generation of pressure. Die defects and many other problems
Furthermore, it has been found that the composition described in Patent Document 3 is prone to stamper stains and requires frequent stamper cleaning. Although an antioxidant is added, it is strongly colored when heated at 220°C. material is not suitable
[0012] That is, it can be seen that although various studies have been made on curable compositions for the purpose of being used in lenses, etc., there are still some shortcomings, but there is no photocurable composition for molding that is excellent overall.

Method used

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  • Photocurable composition for embossing and method for producing cured products
  • Photocurable composition for embossing and method for producing cured products
  • Photocurable composition for embossing and method for producing cured products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment A

[0143] The polymerizable monomers, photopolymerization initiators, antioxidants, silane coupling agents and silicone oils shown in the following Tables 1 to 3, and other components added as needed were blended to prepare a composition. In Tables 1 to 3, the content of each component is expressed in% by weight.

[0144] The composition obtained above was subjected to the following tests and evaluated. The results are shown in Tables 1 to 3. The viscosities of Examples 1 to 12 and Comparative Examples 4 to 7 were in the range of 90 to 1000 mPa·s. In addition, the viscosities of Comparative Examples 1 to 3 and 8 are outside the range of 90 to 1000 mPa·s.

[0145]

[0146] The viscosity measurement was performed at 25±0.2°C using an RE-80L rotational viscometer manufactured by Toki Sangyo Co., Ltd. Regarding the rotation speed during the measurement, when the viscosity is 0.5 mPa·s or more and less than 5 mPa·s, the rotation speed is 100 rpm; when the viscosity is 5 mPa·s or more an...

Embodiment B

[0206] In Examples 1, 2, 4 to 12 of Example A, the silane coupling agent and the silicone oil were not added, and the others were carried out in the same manner. The results show that although the obtained composition is at a practical level, it has coating suitability, mold release properties, glass substrate adhesion after exposure, mold stains, glass substrate adhesion after heating, and damage resistance after heating Any one or more of the properties tends to deteriorate slightly.

[0207] In Examples 1, 2, 4 to 12 of Example A above, a silane coupling agent (KBM903, manufactured by Shin-Etsu Chemical) was used instead of the amino-free silane coupling agent (KBM5193, manufactured by Shin-Etsu Chemical), and the others were the same get on. As a result, it can be seen that although the obtained composition is at a practical level, it slightly deteriorates in any one or more of mold release properties, glass substrate adhesion after exposure, mold dirt, and glass substrate a...

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Abstract

The present invention provides a photocurable composition for embossing having excellent performance. The composition contains more than two polymerism monomers or polymerism oligomers, and has a degree of viscosity from 90 to 1000 mPa*s. The composition meets (1) or (2): (1) more than 85% by weight of the polymerism monomers or the polymerism oligomers are composed of polymerism monomers or polymerism oligomers (A) containing more than three function groups and having a degree of viscosity from 2000 mPa*s to 10000 mPa*s, and polymerism monomers or polymerism oligomers (B) containing single function group or two function groups and having a degree of viscosity less than 200 mPa*s; (2) the polymerism monomers or the polymerism oligomers contains polymerism monomers or polymerism oligomers (C) containing more than three function groups and having a degree of viscosity less than 800 mPa*s, and polymerism monomers or polymerism oligomers (D) containing single function group or two function groups and having a degree of viscosity from 200 mPa*s to 7000 mPa*s.

Description

Technical field [0001] The present invention relates to a photocurable composition for molding and a method for producing a cured product using the composition. In particular, it relates to a photocurable composition for molding (also referred to as embossing or embossing) for forming lens patterns. Background technique [0002] Optical devices such as exposure devices for semiconductors, endoscopes, recording and reproducing devices, and display devices are equipped with Fresnel lenses, biconvex lenses, prism sheets, lens arrays, and other optical lenses that have fine irregularities on the surface. optical lens. In addition, from the viewpoint of ease of precision processing, resins are often used for precision optical lenses. [0003] However, damage to the resin lens is a major problem. For this reason, in Patent Document 1, a hard lens having a pencil hardness of 3H or more is produced by using a specific resin. However, in Patent Document 1, since it is produced by inject...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F222/20C08F220/32C08F222/10C08F2/48C08L35/02C08L33/14G02B1/04G02B3/00
CPCG03F7/004G03F7/0045G03F7/0047G03F7/027G03F7/20
Inventor 高柳丘安藤豪
Owner FUJIFILM CORP
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