Laser cutting device with workpiece bottom immersed in liquid level

Abstract

The invention relates to a laser cutting device with a workpiece bottom immersed in liquid level, comprising a liquid container, a workpiece fixing part, a laser generating part and a circulation system, wherein the liquid container is used for accommodating liquid; the workpiece fixing part is used for fixing a workpiece and comprises a first surface and a second surface, wherein the first surface of the workpiece is immersed into the liquid; the laser generating part is used for generating a laser beam to the second surface of the workpiece in order to cut the workpiece; the circulation system comprises an inlet, a circulation drive part, a circulation filter part and an outlet, wherein the inlet and the outlet are connected with the liquid container, the circulation drive part is used for driving the liquid to flow into the circulation system from the inlet, and the liquid back flows into the liquid container from the outlet after being filtered by the circulation filter part. The invention has the advantages of high cutting quality, good cooling effect, and the like.

Description

technical field [0001] The invention relates to a laser processing device, in particular to a laser cutting device in which the bottom surface of a workpiece is immersed in a liquid surface. Background technique [0002] Such as figure 1 , Figure 2A , Figure 2B and Figure 2C As shown, the existing laser processing device has a laser generator 930 for generating a laser beam 931 to a workpiece 950, and then cutting the workpiece 950 in air. [0003] However, the existing laser processing device cuts in the air, which is easy to cause high temperature, debris and uneven surface of the cutting position (for example: the formation of burrs), and the cutting quality is poor; Figure 2C It can be seen that, after the workpiece 950 is cut by the laser beam, raised burrs 952 are likely to be generated on an upper surface 951A and a lower surface 951B, resulting in an uneven surface. [0004] In the process of laser processing glass, cracks, bumps, residues, and burnt phenome...

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Problems solved by technology

[0005] However, when the laser is processed in the liquid, there will be problems such as interference or power reduction, and the loss will be different depending on the combination of the laser and the liquid. For example, the carbon dioxide laser has a high water absorption coefficient. When applied in water for processing, it is easily absorbed by water

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