Laser cutting device with workpiece bottom immersed in liquid level

A technology of laser cutting and immersion liquid, which is applied in the direction of glass cutting devices, laser welding equipment, manufacturing tools, etc., can solve the problems of different loss, interference power, reduction, etc., and achieve good cooling effect and good cutting quality.

Inactive Publication Date: 2010-12-22
CONTREL TECH CO LTD
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  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when the laser is processed in the liquid, there will be problems such as interference or power reduction, and the loss will be different depending on the combination of the laser and the liquid. For example, the carbon dioxide laser has a high water absorption coefficient. When applied in water for processing, it is easily absorbed by water

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  • Laser cutting device with workpiece bottom immersed in liquid level
  • Laser cutting device with workpiece bottom immersed in liquid level
  • Laser cutting device with workpiece bottom immersed in liquid level

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Embodiment Construction

[0048] Such as image 3 And shown in Fig. 4, a kind of laser cutting device that the bottom surface of the workpiece of the present invention is immersed in liquid surface, it comprises:

[0049] A liquid container 10 for containing a liquid 70 (for example: water);

[0050] A workpiece fixing portion 20, used to fix a workpiece 50, the workpiece 50 has a first surface 51 and a second surface 52, the first surface 51 of the workpiece 50 is immersed in the liquid 70;

[0051] A laser generator 30 is used to generate a laser beam 31 onto the second surface 52 of the workpiece 50 to cut the workpiece 50 .

[0052] Such as Figure 4A and Figure 4B As shown, when the laser beam 31 cuts the workpiece 50, it penetrates from the second surface 52 of the workpiece 50 to the first surface 51 to form a cutting wall 53; Figure 4C As shown, at the moment when the cutting wall 53 penetrates, the liquid 70 below the first surface 51 will rush into the cutting wall 53 due to the concent...

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Abstract

The invention relates to a laser cutting device with a workpiece bottom immersed in liquid level, comprising a liquid container, a workpiece fixing part, a laser generating part and a circulation system, wherein the liquid container is used for accommodating liquid; the workpiece fixing part is used for fixing a workpiece and comprises a first surface and a second surface, wherein the first surface of the workpiece is immersed into the liquid; the laser generating part is used for generating a laser beam to the second surface of the workpiece in order to cut the workpiece; the circulation system comprises an inlet, a circulation drive part, a circulation filter part and an outlet, wherein the inlet and the outlet are connected with the liquid container, the circulation drive part is used for driving the liquid to flow into the circulation system from the inlet, and the liquid back flows into the liquid container from the outlet after being filtered by the circulation filter part. The invention has the advantages of high cutting quality, good cooling effect, and the like.

Description

technical field [0001] The invention relates to a laser processing device, in particular to a laser cutting device in which the bottom surface of a workpiece is immersed in a liquid surface. Background technique [0002] Such as figure 1 , Figure 2A , Figure 2B and Figure 2C As shown, the existing laser processing device has a laser generator 930 for generating a laser beam 931 to a workpiece 950, and then cutting the workpiece 950 in air. [0003] However, the existing laser processing device cuts in the air, which is easy to cause high temperature, debris and uneven surface of the cutting position (for example: the formation of burrs), and the cutting quality is poor; Figure 2C It can be seen that, after the workpiece 950 is cut by the laser beam, raised burrs 952 are likely to be generated on an upper surface 951A and a lower surface 951B, resulting in an uneven surface. [0004] In the process of laser processing glass, cracks, bumps, residues, and burnt phenome...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/40B23K26/12B23K26/42C03B33/08B23K26/122B23K26/70
Inventor 郭佳笼
Owner CONTREL TECH CO LTD
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