Method of cutting laminated body

Abstract

The present invention provides a method of cutting a laminated body, capable of obtaining good cutting surface quality without cost and labour hour even that a part (film) of the laminated body (10) has a low elongation rate, wherein the laminated body (10) is cut by a cutting knife (46). The laminated body (10) has a separation film (12) and a multilayer film (16) stacked on the separation film (12) through adhesive agent (14). The multilayer film (16) has a first protection film (18a) stacked on the adhesive agent (14), a polarization mirror (20) stacked on the first protection film (18a), and a second protection film (18b) stacked on the polarization mirror (20). Furthermore, a speed (cutting speed v) of the cutting knife (46) to the laminated body (10) is adjusted to more than 8mm / sec, preferably more than 10mm / sec to cut the laminated body (10).

Description

technical field [0001] The present invention relates to a method for cutting a laminate in which one or more films are laminated with adhesives using a jig for cutting. Background technique [0002] Recently, methods described in JP-A-2006-142445 and JP-A-2003-302524 are known as a method of cutting a laminate in which one or more films are laminated with an adhesive using a cutting blade. [0003] The cutting method described in Japanese Patent Application Laid-Open No. 2006-142445 is a method of reducing the compressive stress applied to the laminated body when the cutting blade cuts the laminated body. The reduction of the compressive stress is applied to the surface side of the laminated body It is carried out under the condition that tensile stress is applied and compressive stress is applied to the inner side. Thus, in the cutting process, the internal stress from the cut surface toward the cutting blade can be relieved, and the closeness between the cut surface and t...

AI Technical Summary

Problems solved by technology

[0005] In the cutting method described in Japanese Patent Application Laid-Open No. 2006-142445, a cutting device having a base and a fixing mechanism for closely fixing the above-mentioned laminated body to the base is used. The surface shape of the compressive stress of the laminated body has a surface shape in which tensile stress is generated on the surface side of the laminated body and compressive stress is generated on the inner side; however, there is a problem that cost and man-hours are required for base preparation

Furthermore, since pressure acts on the surface of the laminate in the plane direction, problems such as wrinkles and deformation may occur.

[0006] In the cutting method described in Japanese Patent Laid-Open No. 2003-302524, the water content of the optical parts is adjusted to 2 to 4 mass%, but since the water content must be 2 to 4 mass% during cutting, there is an optical zero. Problems of cost and man-hours spent on parts storage management and process management

[0007] In addition, in Japanese Patent Application Laid-Open No. 2006-142445 and Japanese Patent Laid-Open No. 2003-302524, the probability of delamination (delamination between layers) or cracks when the laminate is cut varies depending on the elongation of the materials constituting the laminate. There is a large variation in this situation without any testing

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