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Power semiconductor chip welding device

A power semiconductor and chip welding technology, which is applied in the direction of semiconductor devices, electrical solid devices, and electrical components to assemble printed circuits, which can solve the problems of inaccurate welding positions and open circuits of semiconductor chips, and reduce the number of operators and packaging manufacturing. Cost, smooth production effect

Active Publication Date: 2014-01-08
ZHUZHOU CRRC TIMES SEMICON CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a power semiconductor chip welding device, which can well solve the problem of inaccurate soldering position of the semiconductor chip caused by the relative positional movement of the semiconductor chip, sheet solder and insulating elements in the prior art and The technical problem of open circuit caused by the relative position movement of chip resistors, sheet solder and insulating components, to achieve accurate positioning of power semiconductor chip soldering packages

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0027] As a specific embodiment of a power semiconductor chip welding device of the present invention, such as Figure 1 to Figure 7 What is shown is a structural schematic diagram of a specific embodiment of a power semiconductor chip welding device. The power semiconductor chip welding device includes a base plate 1 , an insulating element fixing frame 3 , and a semiconductor chip fixing frame 6 . There are positioning pins 2 at the two diagonal end...

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Abstract

The invention discloses a power semiconductor chip welding device, which is used for welding a high-power high-voltage semiconductor module. The power semiconductor chip welding device comprises a substrate, an insulating element fixing frame, an insulating element and a semiconductor chip fixing frame, wherein the insulating element fixing frame is fixed above the substrate and has an insulating element fixing station; the insulating element is placed on the insulating element fixing frame; the semiconductor chip fixing frame is fixed on the insulating element fixing frame; and element welding positions are distributed on the semiconductor chip fixing frame. In the invention, the problem of inaccurate welding positions of the semiconductor chip caused by the relative position change of a semiconductor chip, a sheet welding material and the insulating element and the technical problem of open circuit caused by the relative position change of an SMD resistor, the sheet welding material and the insulating element are solved, and the accurate positioning in the power semiconductor chip welding and packaging is realized.

Description

technical field [0001] The present invention relates to a chip welding device, in particular to a chip welding device applied to high-power and high-voltage semiconductor modules, such as high-power and high-voltage IGBT modules (insulated gate bipolar transistor modules). The invention can also be applied to other similar field of semiconductor chip bonding. Background technique [0002] At present, high-power high-voltage semiconductor modules, such as high-power high-voltage IGBT modules (insulated gate bipolar transistor modules), are usually packaged with sheet solder to weld semiconductor chips, chip resistors and other components to ceramics (Al2O3), aluminum nitride, etc. (AlN) and other materials made of surface-coated metal insulation components. However, in the current semiconductor chip soldering process, during the packaging process of loading semiconductor chips, chip resistors and other components, transporting soldered components, and welding, there are diff...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH01L24/97H01L2924/13055
Inventor 张泉李继鲁徐先伟彭勇殿吴煜东
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD
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