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Method and device for testing tensile strength of axial lead of glass shell diode

An axial lead and tensile strength technology, which is used in the application of stable tension/compression to test the strength of materials and single semiconductor device testing. or easy removal, ensure test accuracy, and easy-to-obtain results

Active Publication Date: 2010-09-15
FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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Problems solved by technology

[0012] The object of the present invention is to provide a method and device for tensile testing of axially leaded glass-encapsulated diodes, to solve the problem that in the prior art, when conducting tensile tests on glass-encapsulated diodes, the controllable tensile force and temperature range cannot be satisfied at the same time. The problem

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  • Method and device for testing tensile strength of axial lead of glass shell diode
  • Method and device for testing tensile strength of axial lead of glass shell diode
  • Method and device for testing tensile strength of axial lead of glass shell diode

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Embodiment Construction

[0026] The specific implementation manner of the present invention will now be described in conjunction with the accompanying drawings.

[0027] Aiming at the special requirements of the tensile strength test of the axial lead of the glass shell diode, the invention proposes a test device for the tensile strength of the axial lead of the glass shell diode. It includes an axial lead tension application system, a forward voltage measurement system, and a hot air source system. A method for testing the tensile force resistance of an axially leaded glass bulb diode comprises three steps of test preparation, test execution, and test completion.

[0028] The schematic diagram of the test device is shown in the figure. The axial lead tension application system, the forward voltage measurement system, and the hot air source are connected to realize the test of the tensile resistance of the axial lead of the glass shell diode. The axial lead tension application system includes a tes...

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Abstract

The invention relates to a method and a device for testing the tensile strength of an axial lead of a glass shell diode, in particular to a method and a device for testing a glass shell diode, belonging to the technical field of electronic element testing and aiming at solving the problem that the controllability of tension and temperature change range can not be simultaneously satisfied in the tensile testing process of the glass shell diode in the prior art. The invention mainly comprises the device and the method for testing the tensile strength of the axial lead of the glass shell diode, wherein the device comprises a hot air source system, an axial lead tension application system and a forward voltage measuring system. The operations of tensile application and removal, current application, voltage measurement, and the like of the axial lead are carried out outside a high-temperature cabinet. A cabinet door of the high-temperature cabinet is unnecessary to be opened in the whole testing process of forward voltage drop of the diode under the tension and temperature control conditions, thereby ensuring the stability of the environmental temperature inside the cabinet, not influencing the environmental temperature (150 DEG C) of the diode and satisfying the requirements that the environmental temperature of the diode is within 150+ / -5 DEG C.

Description

technical field [0001] The invention belongs to the technical field of testing electronic components, in particular to a glass shell diode testing method and equipment. Background technique [0002] The test method for semiconductor discrete devices (GJB128A-97) stipulates in the mechanical performance test series that the axial lead tensile test of the glass shell diode is required to determine the tensile force resistance of the axial lead glass shell diode, that is, when subjected to tensile force Whether there is any discontinuity or open circuit when the positive test is carried out under the condition of temperature control. [0003] During the test, install the diode under test in the tensile test fixture, connect the electrical monitoring equipment with the diode lead wire, the forward current flowing through the diode is 100mA, and record the forward voltage at this time. Then increase the ambient temperature of the diode to 150°C, and when it stabilizes at this te...

Claims

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Application Information

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IPC IPC(8): G01R31/26G01N3/18
Inventor 林晓玲刘玉清肖庆中李萍
Owner FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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