Method for manufacturing insulation layer of touch panel

Abstract

The invention relates to a method for manufacturing an insulation layer of a touch panel, which comprises the following steps of: plating a first transparent conducting layer on a substrate, cleaning for the first time, then coating a first photoresist layer to generate a conductive circuit graphic, developing for the first time, then etching and decoating the photoresist layer, cleaning for the second time to expose the conductive circuit, coating an organic insulation layer on the first transparent conducting layer, developing for the second time, then plating a second transparent conducting layer on the organic insulation layer, cleaning for the third time, coating a second photoresist layer on the second transparent conducting layer to generate another required conductive circuit graphic, and finally carrying out the third development on the conductive circuit graphic on the photoresist layer with a developer, therefore, the invention achieves the effects of reducing processing procedures and lowering cost when being used for manufacturing the insulation layer of the touch panel.

Description

technical field [0001] The invention relates to a method for manufacturing an insulating layer of a touch panel, in particular to a method for manufacturing an insulating layer of a touch panel that can reduce processing procedures, improve product quality and reduce costs. Background technique [0002] At present, when making the insulating layer of the general existing touch panel, at least need to carry out: glass substrate→indium tin oxide coating→cleaning→photoresist coating→developing→etching→stripping→silicon dioxide insulating layer Coating → cleaning → photoresist coating → development → BOE etching or dry etching → stripping → indium tin oxide coating → cleaning → photoresist coating → development → etching → stripping and other steps, thus completed Fabrication of the insulating layer of the touch panel, wherein the BOE etching refers to Buffered Oxide Etch (BOE) buffered oxide etching. [0003] Although the steps mentioned above can complete the production of th...

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Problems solved by technology

[0003] Although the steps mentioned above can complete the production of the insulating layer of the touch panel, because the silicon dioxide insulating layer is coated, it must also go through cleaning, photoresist coating, development and BOE etching or dry etching, etc. steps, so that the formation speed of the silicon dioxide insulating layer is relatively slow, and when BOE etching or dry etching is performed in this step, not only will the processing process be more dangerous, but also have adverse effects on the environment, resulting in the existing touch panel When making the insulating layer, the relevant steps are relatively complicated, resulting in a waste of man-hours and processes, and at the same time increasing the cost of manufacturing; therefore, the above-mentioned existing method of manufacturing the insulating layer of the touch panel cannot meet the needs of actual use

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