Device and method for spraying liquid material film based on ultrasonic vibration table

Abstract

The invention specifically relates to a device and a method for spraying liquid material film based on an ultrasonic vibration table, belonging to the technical field of semiconductors. The invention provides the device for spraying liquid material film based on the ultrasonic vibration table in order to improve the evenness of a sprayed film and reduce the usage amount of a spraying solution, the waste and the environment pollution, and the device comprises a nozzle moving mechanism, an ultrasonic atomizing nozzle, a device adsorbing component and an ultrasonic vibrating component, wherein the nozzle moving mechanism is used for moving the ultrasonic atomizing nozzle, the ultrasonic atomizing nozzle is used for atomizing liquid to form superfine liquid drops, the device adsorbing component is arranged below the ultrasonic atomizing nozzle and is used for adsorbing and fixing substrate devices to be sprayed, and the ultrasonic vibrating component is arranged at the lower end of the device adsorbing component and is used for vibrating the spraying substrate devices in the vertical direction. By the method, while the evenness of photoresist coated on a wafer is improved, the usage amount of the used photoresist is largely reduced, thus the generated environment problems are also reduced.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a liquid material film spraying device and method based on an ultrasonic vibrating table. Background technique [0002] As everyone knows, in the field of semiconductor technology, when a semiconductor coating, an insulating layer, or an electrode layer formed on a semiconductor substrate device (such as a wafer) is to be corroded into a predetermined pattern, a protective film is formed on the surface of the coating as a pattern Partial cover. [0003] Spin coating is a commonly used method of forming a protective film. According to this method, the wafer is placed and fixed on a rotating table. For example, the photoresist solution is dropped on the center of the upper surface of the wafer. Due to the rotation and centrifugal action of the wafer, the protection solution diffuses spirally from the center of the wafer to the edge, thereby coating the photores...

AI Technical Summary

Problems solved by technology

[0010] The technical problem to be solved by the present invention is to improve the uniformity of the liquid film in the coating process, and at the same time reduce the amount of coating solution used in the existing liquid material film spraying technology, and reduce waste and environmental pollution

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