Intelligent card heat dissipating device and manufacturing method thereof

The technology of a heat dissipation device and manufacturing method, which is applied in the field of machinery, can solve the problems of poor heat dissipation effect of card holders and the like

Active Publication Date: 2010-07-07
HUAWEI DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The embodiment of the present invention provides a smart card cooling device and its manufacturing method, which solves the technical problem of the poor cooling effect of the existing smart card holder

Method used

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  • Intelligent card heat dissipating device and manufacturing method thereof
  • Intelligent card heat dissipating device and manufacturing method thereof
  • Intelligent card heat dissipating device and manufacturing method thereof

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] Embodiments of the present invention provide a smart card cooling device with good heat dissipation effect, low cost and wider application range and a manufacturing method of the smart card cooling device.

[0031] Such as figure 2 As shown, the smart card heat dissipation device provided by the embodiment of the present invention includes a heat transfer element 2 and a heat dissipation structure 4 arranged on the circuit board 1, and the chip 30 of the sm...

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PUM

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Abstract

The embodiment of the invention discloses an intelligent card heat dissipating device and a manufacturing method thereof, belongs to the technical field of the machinery and solves the technical problem of bad heat dissipating effect of the card holder of the existing intelligent card. The intelligent card heat dissipating device comprises a heat transfer component and a heat dissipation structure which are arranged on a circuit board, wherein the heat transfer component is fixed on a first surface of the circuit board; an intelligent card is fixedly clamped on the heat transfer component in a dismountable mode; a chip of the intelligent card is pressed against the heat transfer component; the chip is electrically connected with a power consumption device on the circuit board; the heat dissipation structure is arranged between the circuit board on the periphery of the heat transfer component and a second surface of the circuit board and / or is arranged on the region on the second surface of the circuit board opposite to the position of the heat transfer component; and the positions of the second surface and the first surface on the circuit board are opposite to each other. The invention is used to reduce a temperature of the chip of the intelligent card in the working process.

Description

technical field [0001] The invention belongs to the technical field of machinery, and in particular relates to a smart card cooling device and a manufacturing method thereof. Background technique [0002] With the continuous development of electronic technology, smart cards (Smart cards) are more and more widely used in electronic equipment. [0003] A smart card is also called an integrated circuit card (Integrated Circuit card, IC). Existing smart cards mainly include contact and contactless. Contact smart cards are usually used with smart card holders. [0004] Such as figure 1 As shown, the existing smart card holder includes a reed-shaped metal sheet 21 fixed on the surface 11 of the circuit board 1, and a card holder shell 6, wherein: the card holder shell 6 is covered on the metal sheet 21, and the card holder A slot 61 is provided on the side wall of the casing 6, the smart card 3 is embedded in the slot 61 and the chip 30 on the smart card 3 abuts against the me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K7/00H01L23/367H01L21/50
Inventor 郭俊生
Owner HUAWEI DEVICE CO LTD
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