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Semiconductor carbon dioxide supercritical sweeping and cleaning machine

A carbon dioxide and supercritical technology, applied in semiconductor/solid-state device manufacturing, cleaning methods and appliances, chemical instruments and methods, etc., can solve the problems that water is not a cleaning medium, the surface tension is large, and impurities cannot be effectively cleaned

Inactive Publication Date: 2010-06-16
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The traditional semiconductor cleaning process consumes a lot of water, and due to the high surface tension of water, it is impossible to effectively clean the impurities between the slits and lines on the wafer
At the same time, due to the high viscosity of water, it is easy to cause serious adsorption and adhesion problems when drying
So water is not the best cleaning medium

Method used

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  • Semiconductor carbon dioxide supercritical sweeping and cleaning machine
  • Semiconductor carbon dioxide supercritical sweeping and cleaning machine
  • Semiconductor carbon dioxide supercritical sweeping and cleaning machine

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Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0029] This semiconductor carbon dioxide supercritical cleaning machine provided by the invention has a structure such as figure 1 shown. The main structure of the equipment is a cleaning chamber 1 and a separation chamber 3, and the structural design of the cleaning chamber is the key to determining the cleaning and drying effect of the equipment.

[0030] The semiconductor carbon dioxide supercritical cleaning machine specifically includes:

[0031] bracket 10;

[0032] The cleaning chamber 1 and the separation chamber 3 fixed on the bracket 10, and the cleaning chamber 1 and the separation chamber 3 are communicated at the bottom through a sealed carbon dioxide outlet pipe 12;

[0033] The magnetic rotating device 6...

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Abstract

The invention discloses a semiconductor carbon dioxide supercritical sweeping and cleaning machine. A cleaning cavity is internally provided with a magnetic-driven rotating device. Carbon dioxide supercritical fluid has no surface stress, low glutinousness as well as strong diffusivity and dissolving capacity, thereby being capable of performing effective clean and supercritical drying for fine structures on silicon wafers. The semiconductor carbon dioxide supercritical sweeping and cleaning machine has the main structure of the cleaning cavity, and can achieve an ideal cleaning effect by additionally arranging the magnetic-driven rotating structure and a matched nozzle in the design. The development and manufacture of the semiconductor carbon dioxide supercritical sweeping and cleaning machine can greatly promote the development of the semiconductor cleaning technology.

Description

technical field [0001] The invention relates to semiconductor cleaning equipment, in particular to a semiconductor carbon dioxide supercritical purge cleaning machine. Background technique [0002] The traditional semiconductor cleaning process consumes a lot of water, and due to the high surface tension of water, it is impossible to effectively clean the impurities between the slits and lines on the wafer. At the same time, due to the high viscosity of water, it is easy to cause serious adsorption and adhesion problems when drying. So water is not the best cleaning medium. [0003] Carbon dioxide is easy to enter the supercritical state. The carbon dioxide supercritical fluid has zero surface tension, low viscosity, strong diffusion ability and solvency ability, and can effectively clean and supercritically dry the microstructure on the silicon wafer. Moreover, carbon dioxide is odorless, non-toxic, non-combustible, and environmentally friendly. It is an ideal next-genera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/02B08B7/00
Inventor 惠瑜景玉鹏
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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