Composite heat sink of electrical circuit

Abstract

A composite heat sink of an electrical circuit comprises a radiator. One side of the radiator is provided with a plurality of radiating fins and the other side thereof is provided with a thermally conductive insulating layer. The thermally conductive insulating layer contains uniformly distributed thermally conductive powder. An electrical circuit layer is arranged on the thermally conductive insulating layer and contains uniformly distributed plastic materials and low-impedance electrically conductive powder. The electrical circuit layer is provided with connection points so that the electrical circuit layer can be electrically connected with an electronic component via the connection points. An insulating paint layer is arranged outside the thermally conductive insulating layer and the electrical circuit layer and has anti-soldering effect, so that the component or IC with heat source on the circuit can directly diffuse to rapidly dissipate heat in an overall manner to substantially reduce the thermal resistivity and ensure the effectivity and service lives of the electrical and electronic components.

Description

technical field [0001] The present invention relates to a radiator, in particular to an electrical circuit that can directly diffuse the heat energy generated by an electrical circuit and dissipate heat quickly, greatly reducing the thermal resistance coefficient, and effectively ensuring the performance and service life of electrical and electronic components. Composite radiator. Background technique [0002] At present, lighting equipment includes street lighting, advertising lighting, indoor lighting and machine equipment lighting. The lighting sources of general lighting equipment mostly use incandescent bulbs, fluorescent tubes, mercury lamps and other types. In addition to mercury vapor causing environmental pollution, lighting efficiency is poor, and consumption In addition to the relatively increased power, it is easy to be damaged, and its service life is short, so that it needs to be repaired and replaced frequently, which wastes manpower, material resources and ti...

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Problems solved by technology

[0009] In order to strengthen the heat dissipation of LEDs, the FR4 printed circuit board of type 1 is not enough. Therefore, a type 2 printed circuit board with a metal core (MCPCB) is proposed. The best metal to accelerate heat dissipation, although the second type (MCPCB) can achieve the effect of heat dissipation, but also due to the characteristics of the insulating layer, the heat conduction is limited; the third type of ceramic substrate structure is only suitable for small size and extremely high operating temperature and easy handling of high power components on

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