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Edge contact clamping type wafer end actuator

An end-effector and edge-contact technology, applied in semiconductor/solid-state device manufacturing, electrical components, surface-polished machine tools, etc., can solve the problems of particle contamination on the back of the wafer, wafer shedding, economic loss, etc., and achieve a simple structure, The effect of reducing equipment cost and increasing safety

Inactive Publication Date: 2010-06-09
THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

The widely used vacuum adsorption method has certain limitations. Due to the gradual increase in the weight of the wafer, a larger adsorption area is required to ensure reliable adsorption, which inevitably causes particles on the back of the wafer during the wafer grabbing process. Pollution; when the vacuum is suddenly lost, it is easy to cause wafers to fall off, break and other consequences, resulting in economic losses

Method used

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  • Edge contact clamping type wafer end actuator
  • Edge contact clamping type wafer end actuator
  • Edge contact clamping type wafer end actuator

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Embodiment Construction

[0025] see Figure 1 to Figure 5 The structure of the edge contact clamping type wafer end effector is as follows: it has a wafer seat 2, and the wafer seat 2 is provided with two edge contact clamping finger hooks 1, the edge contact clamping finger hook 1 and The finger hook telescopic device is connected; the finger hook is provided with a notch shape corresponding to the shape of the wafer; the finger hook telescopic device has the following structure: one end of the spring is fixed on the wafer seat 2, and the other end is installed on the magnetic plate 11, and the magnetic The suction plate 11 is connected to the edge-contact clamping finger hook 1 through the telescopic guide rod 9 , and an electromagnet 10 is provided on one side of the magnetic suction plate 11 . The spring is a tension spring 12, and the electromagnet 10 is located on the other side of the magnetic plate 11, and is provided with a spring pressure regulator 14 (which may be a nut). Wafer contact pad...

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Abstract

The invention provides an edge contact clamping type wafer end actuator belonging to the technical field of chemical mechanical polishing equipment. The edge contact clamping type wafer end actuator comprises a wafer seat, the wafer seat is at least internally provided with two telescopic type edge contact clamping finger hooks which are connected with a telescopic device; and the wafer seat is at least provided with a third edge contact clamping contact. The invention well solves the problems which exist for a long time and are unsolved all the way in the prior art, clamps wafers in an edge contact way, fast, accurately and safely clamps the wafers without pollution, has simple structure, safe and convenient use and reduced cost, automatically determines the circle centers of the wafers and can be widely used for the processing, i.e. chemical mechanical polishing (CMP), grinding, thinning, and the like of the wafers.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing equipment. Background technique [0002] Integrated circuit (IC) manufacturing is the core of the electronic information industry and one of the most important high-tech technologies to promote the development of national economy and social informatization. More than 90% of ICs in the world use silicon wafers. The development of IC follows "Moore's law", the integration level of the chip quadruples every 3 years, and the feature size is reduced by 1 / 3. That is, the wafer size is getting larger and the characteristic line width is getting smaller and smaller. At the same time, in order to improve the utilization rate of the wafer and increase the chip output, it is also required to achieve sub- Micron-level surface accuracy. Therefore, reducing the pollution in the wafer clamping process is of great significance to improving the quality of the final wafer product. [0003]...

Claims

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Application Information

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IPC IPC(8): H01L21/687B24B29/00
Inventor 李伟柳滨陈威王东辉王伟
Owner THE 45TH RES INST OF CETC
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