Method for producing stepped PCB board

Abstract

The invention discloses a method for producing a stepped PCB board, which is characterized by comprising the following steps: a, windowing an inner core board; b, respectively pasting windowed prepregs on two surfaces of the inner core board, and making windows on the prepregs opposite to the window on the inner core board; c, putting silicon sheets into the windows on the inner core board and the prepregs; d, respectively arranging an outer core board on the surfaces of the two prepregs, and performing lamination; and e, cutting a stepped groove with laser, and taking the silicon sheets and the cut outer core boards out to form the stepped PCB board. In the method, the position of the stepped groove can be precisely positioned, the size and depth of the stepped groove are precisely ensured, and the groove wall of the stepped groove is neat and non-defective; the laminated panel and the silicon sheets after laser cutting can be easily taken out, and do not stick to the groove bottom; in addition, the inner core board and the prepregs are required to be windowed only, and other plates are not required to be windowed, so the working procedures are less. The method is simple, effective and convenient to implement, and is suitable for processing the stepped PCB board.

Description

technical field [0001] The invention relates to a production method of a stepped PCB board. Background technique [0002] Such as figure 1 As shown, it is a multi-layer PCB board 1 with a groove 11 on it. The groove 11 is also called a stepped groove, which is a non-through groove. In the present invention, this kind of PCB board is referred to as a stepped PCB board for short. [0003] The production method of the stepped PCB board in the prior art is to attach prepregs on both surfaces of the inner core board, and then attach copper foil or outer core boards on the surface of the prepreg, and laminate at high temperature. The prepreg is mainly composed of thermoplastic resin, which is solid at room temperature and turns into a semi-fluid liquid at high temperature. When it returns to normal temperature after lamination, the prepreg will bond the multi-layer inner core board, outer core board or copper foil into one. When producing stepped PCB boards, such as figure 2...

AI Technical Summary

Problems solved by technology

However, due to the large error between the mechanical milling core board and the prepreg, the lamination method and other factors, the current method is still difficult to accurately locate the position of the stepped groove, it is difficult to accurately control the size and depth of the stepped groove, and it is difficult to ensure that the walls of the stepped groove are neat no defect issues

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