Device and method for controlling heating temperature of movable type single-particle testing device

Abstract

The invention relates to device and method for controlling the heating temperature of a movable type single-particle testing device. The device comprises a temperature controller, a temperature monitor, a heater, a sensor, a radiator, a clamp, a heating indicating lamp, a heating stop indicating lamp and a remote control terminal, wherein the heater, the sensor and the radiator are all independently designed devices which can conveniently realize the control of the heating temperature of the single-particle testing device through connecting and matching with the clamp which is in a shape like the Chinese character of 'ao' and specially designed; the structural design is of a mobile type temperature control device, does not depend on the types of single-particle testing sources and is suitable for the heating temperature control of various single-particle testing devices; the heater, the sensor and the radiator are tightly contacted with the single-particle testing device through the clamp so as to ensure that the whole measured device has small volume and smaller occupied space and is convenient to arrange on a circuit board. The invention is suitable for the prior electronic processes.

Description

technical field [0001] The invention relates to the technical field of single-particle testing, in particular to a movable heating temperature control device and method for single-particle testing devices. Background technique [0002] During the operation of spacecraft in orbit, it is always affected by the space environment, which causes radiation effects such as total dose effect and single event effect on semiconductor devices. The radiation resistance of semiconductor devices directly affects the performance and life of spacecraft, so it is used in aerospace The semiconductor device of the device must undergo a single event effect evaluation test, referred to as the single event test, to evaluate the anti-single event effect ability of the device under test. The single particle test technology uses a complete set of equipment on the ground, including radiation sources, vacuum environments, test devices, heating temperature control devices, and effect detection systems, ...

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Problems solved by technology

At the same time, in order to simulate the real working environment of the device in the space, the single particle test needs to conduct an evaluation test after heating the device in a vacuum environment. Due to the change of the heat conduction mode in the vacuum environment, how to control the heating temperature of the semiconductor device in the vacuum environment is also a problem. very difficult and complex work

[0003] In the single particle test at home and abroad, two methods are usually used to control the heating temperature of the device under test: one is to use the power consumption generated by the single particle test device itself for self-heating, and to control the power consumption generated by it by changing the device's workload. , using the generated power consumption and the heat dissipation difference to the external environment to achieve the effect of controlling the heating of the device. The advantage of this method is that it can be heated without other devices. The disadvantage is that the temperature is not easy to control. At the same time, due to the limited working conditions of the device, it is easy to The damage to the device will also affect the effect of the single particle test; another method is to use the method of external heating temperature control, use the copper cavity directly connected to the radiation source vacuum tank to wrap the device under test, and use the resistance The advantage of this method is that the temperature is easy to control and the heating rate is fast. There are test institutions using this method at home and abroad. For example, the Northwest Institute of Nuclear Technology in China uses the californium source tank to directly assemble the copper cavity. The temperature is controlled by the method of body resistance wire heating. The disadvantage of this method is that the installation of the device is complicated, occupies a large area, needs to be bundled and installed with the radiation source, and cannot be moved. It is not suitable for the single particle test of semiconductor devices.

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